eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC's 28nm process.
Could radio frequency signals become the next major energy source for industrial, scientific and medical (ISM) applications? At the IEEE International Microwave Symposium this week, NXP Semiconductors N.V. is introducing the industry’s first complete RF power transistor portfolio designed specifically for the 2.45-GHz ISM frequency band, enabling RF energy to be used as a clean, highly efficient and controllable heat source.
IBM today introduced the fifth generation of semiconductor technology specialized for high performance communications. The company’s latest silicon-germanium (SiGe) chip-making process is designed to enable ever-increasing amounts of data to flow through network backbones in applications such as Wi-Fi, LTE cellular, wireless backhaul and high speed optical communications.
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that it has received ON Semiconductor’s Perfect Quality Gold Award for 2012. Dow earned the award based on its perfect quality score for both 2011 and 2012 in ON Semiconductor’s FE Supplier Performance Rating as a supplier of chemical mechanical planarization (CMP) and lithography materials.
Dow Electronic Materials, a business unit of The Dow Chemical Company, announces that it has received ON Semiconductor's Perfect Quality Gold Award for 2012.
Dow earned the award based on its perfect quality score...
Research and Markets has announced the addition of the "Semiconductor Equipment Manufacturers (Global)" report to their offering.
Vishay Intertechnology, Inc. today announced that Vishay Intertechnology Asia Pte Ltd has received the 2012 Diamond Award and the 2012 Supplier Excellence Award, Silver, from TTI Electronics Asia Pte Ltd. Vishay is one of the world’s largest manufacturers of discrete semiconductors and passive electronic components. TTI is the world’s leading authorized distributor specialist offering passive, connector, electromechanical, and discrete components.
The semiconductor industry’s march toward broader 3D IC integration marked animportant milestone this week at the 2013Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processingsession, when Ranjith John, materials development & integration engineer at Dow Corning, presented a paper co-authored by Dow Corning, a global leader in silicones, silicon-based technology and innovation, and SÜSS MicroTec, a leading supplier of semiconductor processing equipment.
Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated, and STATS ChipPAC have announced a collaboration to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs.
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone today at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging.
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