Leading semiconductor test equipment supplier Advantest Corporation has earned the Texas Instruments (TI) 2012 Supplier Excellence Award. Advantest provides the M4841 pick-and-place test handler, which TI uses with its installed automated test equipment (ATE). This is the first time that Advantest has received this supplier award from TI.
Applied Materials, Inc. has been recognized as one of 17 companies receiving Intel Corporation's Preferred Quality Supplier (PQS) award for their performance in 2012. Applied Materials is recognized for its significant contributions providing Intel with semiconductor equipment, software and support services deemed essential to Intel's success.
Thermal Engineering Associates, Inc. (TEA) announces that it is now accepting wafer orders for its new 1mm square Thermal Test Chip (TTC-1001). This new chip has many of the same advantages as the popular TEA TTC-1002 (2.5mm square) TTC. The TTC-1001 may be arrayed in many ways to create square or rectangular devices in increments of 1mm.
Plessey announced that samples of its Gallium Nitride (GaN) on silicon LED products (p/n PLW111010) are available today. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
Vishay Intertechnology, Inc. today introduced a new high-performance metallized polypropylene film snubber capacitor. Configurable for direct mounting on insulated gate bipolar transistor (IGBT) modules, the Vishay Roederstein MKP386M features a wide capacitance range from 0.047 to 10 microfarads, high-temperature operation to + 105 °C, and seven voltage ratings from 700 VDC to 2500 VDC and 420 VAC to 800 VAC.
Kansas State University doctoral student Clint Frye is receiving national recognition for his success as a student and his research developing new semiconductors.
Dr. Randhir Thakur, executive vice president and general manager of the Silicon Systems Group at Applied Materials, Inc. has been named Fellow of the Institute of Electrical and Electronics Engineers (IEEE).
NeoPhotonics Corporation, a leading designer and manufacturer of photonic integrated circuit, or PIC, based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced that it has completed the acquisition of the semiconductor optical components business unit (OCU) of LAPIS Semiconductor Co., Ltd., a leading designer and manufacturer of high speed lasers, laser drivers, photodiodes and amplifiers for high speed networks.
Brooks Instrument, a world-leading provider of advanced flow, pressure, vacuum, level and vapor delivery solutions, has launched the GF135, a revolutionary pressure transient insensitive (PTI) mass flow controller for semiconductor manufacturing.
IBM today announced a materials science breakthrough at the atomic level that could pave the way for a new class of non-volatile memory and logic chips that would use less power than today's silicon based devices.
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