A new series of transient voltage suppressor (TVS) components from ProTek Devices™ deliver advanced circuit protection for smartphones, battery chargers and battery packs, and other popular portable consumer electronics devices.
Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies (www.tritonmicrotech.com), to develop innovative via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
AIXTRON SE today announced that US company Transphorm Inc. is stepping up production of gallium nitride on silicon (GaN-on-Si) with its latest order of AIXTRON’s G5+ MOCVD system, capable of handling five 200 mm (5x8-inch) wafers. The order was made in the fourth quarter of 2012 with delivery due in the second quarter of 2013.
AXT, Inc., a leading manufacturer of compound semiconductor substrates, today announced that it has been certified as having met the international standards of ISO 16949:2009, a worldwide standard developed by the International Automotive Task Force (IATF), a group of the world's leading manufacturers and trade organizations.
Axcelis Technologies, Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today the Company's innovative Purion MTM medium current implanter has been selected by another one of the world's leading chipmakers. The system will be used to develop and manufacture next generation memory and FLASH devices.
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited ("BCD") in an all cash deal, valued at approximately $151 million.
Keithley Instruments, Inc., a world leader in advanced electrical test instruments and systems, announced today that the editors of Electronic Products magazine have honored the company’s new Parametric Curve Tracer (PCT) Configurations as a “Product of the Year” award winner for 2012 in the test and measurement category.
MagnaChip Semiconductor Corporation ("MagnaChip"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a 0.35-micron ultra-high voltage 700V BCD (Bipolar/CMOS/DMOS) process technology targeted at the growing smart energy market for applications such as AC-DC and switched-mode power supplies as well as LED lighting.
After experiencing a slowdown in 2012 the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5 percent in 2013 after declining 3.2 percent in 2012.
Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it has been elected to lead the Electronic Component Sintered Interconnections (ELCOSINT) industry team in developing novel polymeric, sintered interconnection materials to replace high lead (Pb) content materials and further increase the operating temperature of electronic assemblies.
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