Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced immediate availability of its comprehensive solution for FinFET-based semiconductor designs.
At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence® Encounter® Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.
Lattice Semiconductor Corporation today announced an array of advancements to its software platforms, debuting new versions of Lattice Diamond® and iCEcube2™ design tools. The updated software prominently features several notable advancements that improve power calculations and design productivity aimed at the creation of mobile and consumer, communication, and industrial systems that undergo fast design cycles, demand power efficiency, and have aggressive cost constraints.
Texas Instruments Incorporated (TI) today announced the company has been named a Thomson Reuters 2012 Top 100 Global Innovator. The program, an initiative of the IP Solutions business of Thomson Reuters, honors corporations and institutions around the world that are at the heart of innovation.
Research and Markets has announced the addition of the "2013 U.S. Semi-Conductor & Electronic Components Mfg. Industry-Capital & Expenses Report" report to their offering.
Vishay Intertechnology, Inc. today introduced a new series of molded MICROTAN® solid tantalum chip capacitors for space-constrained consumer electronics. TL8 series devices employ a high-volumetrically efficient packaging solution to enable the industry's highest capacitance-voltage ratings in small case sizes down to 0805 with low profiles from 0.8 mm to 1.0 mm.
Aerospace and defence industries have both a demand and approval to use Non-RoHS electronic components. New generation microprocessors released to the market are predominantly only available in RoHS packaged options, leaving these aerospace and defence applications with a trade-off between the reliability of leaded packages and the improved performance of the latest ROHS compliant processors.
QuantumClean®, the leading global provider of validated high-purity outsourced process tool parts cleaning, surface treatment, refurbishment, analytical and engineering services to the semiconductor industry, today announced the opening of its first Advanced Technology Cleaning Center® in The Netherlands.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top player in System-on-Chip solutions for the STB (Set-Top Box) market, has announced that its "Liege" family (STiH207 and derivatives) of cost-effective STB solutions has received the highest possible level of security certification from Conax, a leading supplier of state-of-the-art conditional access solutions for digital TV. Conax Contego™ content protection platform ensures that operators can deliver premium content and services to multiple TVs and devices in homes equipped with ST-enabled STBs.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of automotive semiconductors, has revealed the latest generation of its pace-setting switch ICs for vehicle electronics such as lights and body modules. The new devices provide enhanced intelligent features, improve protection and reliability, and are up to 40% smaller than competing alternatives.
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