STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top player in System-on-Chip solutions for the STB (Set-Top Box) market, has announced that its "Liege" family (STiH207 and derivatives) of cost-effective STB solutions has received the highest possible level of security certification from Conax, a leading supplier of state-of-the-art conditional access solutions for digital TV. Conax Contego™ content protection platform ensures that operators can deliver premium content and services to multiple TVs and devices in homes equipped with ST-enabled STBs.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of automotive semiconductors, has revealed the latest generation of its pace-setting switch ICs for vehicle electronics such as lights and body modules. The new devices provide enhanced intelligent features, improve protection and reliability, and are up to 40% smaller than competing alternatives.
Silicon wafers destined to become photovoltaic (PV) cells can take a bruising through assembly lines, as they are oxidized, annealed, purified, diffused, etched, and layered to reach their destinies as efficient converters of the sun's rays into useful electricity.
Mobius Photonics, an innovative producer of short-pulsed fiber laser sources (IR, UV and visible wavelengths), announces the introduction of "G2" -- a family of short-pulsed, high-power, high-repetition-rate fiber laser sources that can produce either ultraviolet (UV), green or infrared (IR) output.
Cascade Microtech, Inc., a leading expert at enabling precision measurements of integrated circuits at the wafer level, today announced the CM300, a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity.
Arctic Sand Technologies, Inc., a fabless semiconductor company transforming power management in electronic devices, today announced that it closed $9.6 million in Series A financing at year-end 2012. A syndicate of financial investors—including Arsenal Venture Partners, Northwater Capital and Ray Stata, and strategic investors, including Dialog Semiconductor and Energy Technology Ventures (ETV, a joint venture involving ConocoPhillips, GE and NRG Energy, Inc.)—awarded the funding to the MIT spin-off, which is commercializing energy-efficient power-conversion chips for multiple markets.
GLOBALFOUNDRIES today announced plans to build a new global R&D facility at its Fab 8 campus in Saratoga County, N.Y. The new Technology Development Center (TDC) is expected to play a key role in the company’s strategy to develop innovative semiconductor solutions allowing customers to compete at the leading edge of technology.
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the world's first Ultra High Definition Television (UltraHD TV) video decoder solution on the market. Learn how Broadcom® innovation is enabling the Connected Life at home, at work, and on-the-go at Broadcom@CES.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading producer of ICs for cable set-top boxes and home gateways, has revealed the first three chips in its new family supporting the DOCSIS 3.0 cable-modem specification.
Almost all computer chips use two types of transistors: one called p-type, for positive, and one called n-type, for negative. Improving the performance of the chip as a whole requires parallel improvements in both types.
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