New Thermal Adhesive for Heat Dissipating Applications in Electronics

Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices.

The 100% solid, B-stage adhesive-preform provides a high bond strength, no-mess solution to electronic assembly and other industrial bonding and sealing operations. An attractive characteristic of the FL901AO epoxy preform is its ability to cure quickly at quite moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Also, squeeze out during bonding is almost non-existent. While FL901AO exhibits a thermal conductivity on a level of 10 BTU•in/ft²hr°F, it is highly electrically insulating, with volume resistivity exceeding 10x1012 ohm-cm. The properties of FL901AO are substantially maintained over a wide temperature range from -100°F to 400°F and upon prolonged exposure to harsh environmental conditions such as moisture, heat and other chemicals. It also features outstanding resistance to thermal shock, vibration and impact.

Master Bond's FL901AO film preform is available in a range of film thicknesses and can be laser or die cut to the configuration of any part. Master Bond also offers the extra service of applying the preformed epoxy film directly onto parts and then returning them to the end user for assembly.

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