Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K).
At the Technische Universität Dresden (TU Dresden), physicists have established the first implementation of a complementary vertical organic transistor technology, which can operate at low voltage, with adjustable inverter properties, and a fall and rise time of below 10 ns shown in inverter and ring-oscillator circuits, respectively.
Electronic circuits that compute and store information contain millions of tiny switches that control the flow of electric current.
In the age of digitalisation, electronics products are becoming increasingly ubiquitous.
Panacol has developed a new reworkable underfill for consumer electronics. The reworkability and fluorescence despite its black color of the new Structalit® 5751 adhesive allows manufacturers to reduce both manufacturing costs and environmental impact by reusing electronic components mounted on PCBs.
The complementary base pairing rules can be used to design and assemble a wide range of complex secondary structures, which can help develop DNA molecular devices with unique functions that significantly contribute to diverse research fields.
At the Tokyo Metropolitan University, scientists have employed high-power impulse magnetron scattering (HiPIMS) to make thin films of tungsten with unparalleled low levels of film stress.
Nordson Electronics Solutions, a division of Nordson Corporation, a global leader in plasma processing technology, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing.
Engineers from the University of California, Los Angeles (UCLA), have successfully incorporated a new semiconductor material into a high-power computer chip to reduce the build-up of heat on processors and thus enhance their performance.
A research team led by Professor Jang-Sik Lee of Pohang University of Science and Technology has successfully developed the halide perovskite-based memory with ultra-fast switching speed.