Sep 29 2005
TFT-LCD maker BOE HYDIS has announced that it has successfully developed a chip-on-glass LCD module where the wires that connect the printed circuit board (PCB) and the LCD panel are significantly reduced to improve product reliability.
The new technology was successfully applied to 12.1 and 14.1-inch notebook LCD panels, a first for panels larger than 10-inches.
The newly developed LCD module adopts chip-on-glass (COG) technology, where the driver IC is directly attached to the panel, unlike the conventional method of attaching it to the film. The film linking the LCD panel and the PCB is eliminated and the conventional 400 to 500 wire-linked structure is replaced with one or two flexible printed circuit boards (FPCB). And since the signal line and the power line that interconnect the PCB and the driver ICs are placed on the panel, the size of the PCB can be reduced by half or more.
The cost of circuit parts can then be cut by 30% by removing the chip-on-film (COF) where the driver ICs are installed, and through reducing the size of the PCB. The decreased links between the PCB and the LCD panel also significantly improve product reliability, and the location flexibility of the PCB on the LCD panel makes the technology easily applicable to a variety of products.
The LCD industry has made repeated attempts to apply COG technology in mid-to large-size products in an effort to cut costs. But technological obstacles, such as lowered voltage and signal distortion with increased resistance (attributed to the driver IC chip being placed on the panel, as well as the signal and power lines), rendered their trials unsuccessful.
BOE HYDIS has commenced with the development of the 12.1 inch product using this technology, and plans to start mass production as early as the beginning of next year. The company expects that wider applications to various products will soon be available.
Chief Youngjin Lim of the Development Center at BOE TFT-LCD SBU explained, “The new technology is expected to improve product reliability and cut costs considerably. Basic equipment and facilities have already been prepared for the company to enter into the mass production phase early next year.”
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