Jan 2 2015
STATS ChipPAC Ltd., a leading provider of advanced semiconductor packaging and test services, today announced its plan to relocate the Company's wholly-owned subsidiary, STATS ChipPAC Shanghai, Co., Ltd. to a new manufacturing site in China.
SCC is a 983,000 square foot packaging and test operation located at No. 188 Huaxugong Road, Xujing Town, Shanghai, People's Republic of China (PRC). Recent changes in the long term zoning, development and construction plans for the West Hongqiao area of China have resulted in the need to relocate SCC by the end of 2017. STATS ChipPAC will be working with the Qingpu Land Planning Bureau, the Qingpu District Land Reserve Center and the Shanghai Qingpu District Xujing Town House and Land Expropriation Compensation Office to transfer the land currently occupied by SCC to the relevant PRC local authorities and identifying a new location for the manufacturing operation.
"As we work with the local PRC authorities to develop a timeline to relocate SCC, our top priority will be to minimize any potential disruptions for our customers and employees. The relocation of SCC to a new site is expected to take place in late 2017," said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC. "Our goal is to select a new location that will be in close proximity to our current site. Once a new site has been identified, we will prepare a carefully phased transition plan with each of our customers to ensure a successful move."
Established in 1994, SCC provides high volume, low cost turnkey solutions encompassing wafer bump, wafer probe, packaging, final test and distribution services. SCC offers a broad portfolio of leaded, laminate, stacked die, memory card and flip chip packages to support multiple customers in the communications, consumer and computing markets.
Source: http://www.statschippac.com