Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.

This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~ 23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas. “It is designed to cure in 10-30 seconds at 365nm with 10-40 mW/cm2 of UV output, followed by a post cure at 180°F (~ 80°C) for 30-60 minutes. This system has been specially designed for applications involving heat sensitive components”, says Rohit Ramnath, Senior Product Engineer. “The product is serviceable from -60°F to 350°F (-51°C to 177°C) and it offers a lower coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C compared to other UV curing systems.”

Master Bond UV22DC80-10F is 100% solids and is not oxygen inhibited. It is capable of curing up to thicknesses of around 0.050 inches. The product can be used for bonding, sealing, coating and glob-top type applications. It has a refractive index of 1.52 at 589 nm. It is available for purchase in 10 cc and 30 cc syringes, ounce jars, ½ pint, 1 pint, and quart containers. The shelf life at 40-50°F is 6 months in the original unopened containers.

Master Bond UV22DC80-10F is a one part dual UV and heat cure system with unique flow characteristics. It features optical clarity, excellent bond strength, thermal stability and convenient, easy application. Read more about our dual cure adhesives here or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: [email protected]

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