Adhesives, Sealants, Coatings, Potting and Encapsulation Compounds for the Electronics Industry

Specific Master Bond grades of adhesives, sealants, coatings, potting and encapsulation compounds for the electronics industry offer the following features:

  • High bond strength to similar and dissimilar substrates
  • Thermal and electrical conductivity
  • Superior electrical insulation properties
  • Low stress
  • Low outgassing
  • Dimensional stability
  • Low coefficients of thermal expansion
  • High and low temperature serviceability
  • Resistance to water and a wide range of chemicals
  • Fast cures at ambient temperatures or slightly elevated temperatures
  • Withstand exposure to vibration, impact and shock
  • Exceptional durability
  • Easy repairability

Master Bond Adhesive Products for the Electronic Industry

The following table summarizes Master Bond's range of adhesives, sealants, coatings, potting and encapsulation compounds for the electronics industry.

Application

Product

Description

Silver Conductive

EP21TDC/S

Two part, room temperature curing, silver conductive epoxy with a service temperature range of 4K to 275°F. Excellent mechanical properties and high sheer and peel strength. One to one mix ratio and low volume resistivity <10-3 ohm-cm.

Underfill Potting

EP3RR-1

This potting and underfill one part heat cured epoxy features a fast cure, as well as good heat resistance.  Additionally, this product is thermally conductive, castable to 1 inch thick, and serviceable from -60º to 400ºF.

Thermal Conductive

EP30AN-1

Two part, room temperature curing epoxy with good electrical insulation properties. Used primarily in potting and bonding.  Low viscosity and good flow properties.  Meets NASA low outgassing specifications and exhibits exceptional thermal conduction properties

Chemical Resistant

EP41S-1

Two part, room temperature curing epoxy widely used as a bonding, coating, and potting epoxy where excellent solvent resistance is needed.  Exhibits good flow properties and excellent bonding characteristics.

Low Outgassing

SUPREME 10HT/S

One part, heat cured system (125-150°C) with excellent electrical conductivity and physical properties.  Widely used for die attach and chip bonding.  Outstanding bonding and thermal cycling capabilities.

Silicone

MASTERSIL 713

One part, room temperature curing RTV.  Rapid setting with excellent flexibility, very low viscosity, and outstanding temperature resistance.  Additionally, exhibits resistance to moisture, and is often used as a compound coating with remarkable repairability.

Shielding

AC85

Acrylic based, silver conductive, one part system for EMI/RFI shielding. Surface resistivity <0.01-0.03 (ohm²).

Typical Electronic Applications for Master Bond Adhesive Products

Typical applications of Master Bond's range of adhesives, sealants, coatings, potting and encapsulation compounds products include:

 
  • Die attach adhesive for chip stacking BGA, high thermal BGA, LED, and smart card application
  • EMI Shielding and gasketing
  • Bonding of Capacitors
  • Electro plating
  • Transducer mounting
  • Stress relief bridge bonds
  • Backfilling connectors
  • Speaker Repair
  • Tamperproofing
  • Potting of high voltage transformers and sensors
  • Potting LED arrays
  • Sensor device/OEM Implantation
  • Adhesion to GaAs devices
  • SMD Bonding
  • Wire tacking
  • LCD/LED adhesive for laminating glass layers
  • As a dielectric layer in the fabrication of capacitors
  • Laminating PZT ferroelectrics
  • Motors
  • Inductor coils
  • Bonding ferrite cores and magnets
  • Satellite transmission
  • Staking electrical components to chassis or circuit boards
  • Surface mount
  • RFID and smart card assembly
  • To repair mechanical or thermal damage to PC board base material
  • Lifted conductor repair
  • Securing electrical connectors
  • Piezoelectric devices
  • Coating of thermistors
  • Manufacturing of LCD, Plasma, CRT, and PTV cabinets
  • Cellular phones
  • Printers
  • Cameras
  • Creation of optical circuits in wave guides
  • For application in telecommunication devices
  • Bonding of components within the hard drive
  • Fixing of voice coil to armatures
  • Adhesion of bonded magnet to rotor yoke in a spindle motor
  • Bearing cartridge assembly
  • Sealing of electrical modules

Customized Packaging to Customer Specifications

Master Bond offer a wide array of packaging options to speed productivity, minimize waste and save energy including:

  • Quantities from grams to gallons
  • Cans, bottles and jars
  • Cartridges for manual and pneumatic guns
  • Premixed and frozen syringes for two part systems
  • Bipaks for field service kit

New Electronic Grade Epoxies Developed by Master Bond

Product Description

MASTERSIL 151

Two part room temperature curing silicone. Primarily for potting & encapsulation. Offers the ultimate in “low stress properties”. Resists temperatures up to 400°F.

EP21TCHT-1

Thermally conductive, two component epoxy with paste consistency. Cryogenically serviceable. High temperature resistant for bonding and sealing. Cures at room temperature.

EP21TDC/SFL

Highly flexibilized version of EP21TDC/S silver-filled conductive epoxy. Superb for bonding & sealing dissimilar substrates. Enhanced thermal cycling properties. High peel and shear strength.

EP79

Cost effective alternative to silver-filled epoxy with a silver-coated nickel filler. Excellent conductivity and physical properties.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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