Adhesive Bonding Systems, Sealants, Coatings, Potting and Encapsulation Compounds for the Assembly of Appliances

Master Bond formulates the widest selection of epoxies, silicones, polyurethanes, polysulfides, cyanoacrylates and UV cures to meet your needs.

Important Adhesive Performance Requirements

Master Bond adhesives are designed to meet specific performance requirements. Specific Master Bond grades offer:

  • Serviceability in low and high temperatures
  • Fast cures for high-speed assembly application
  • Low-stress
  • Vibration dampening
  • Resistance to vibration, impact and shock
  • Enhanced chemical and moisture resistance
  • Superior electrical insulation properties
  • Thermal and electrical conductivity
  • UL-94V0 recognized for flame resistance
  • High bond strength to similar and dissimilar substrates

Adhesive Bonding, Sealants, Coatings, Potting

Master Bond Adhesive Bonding Products

The following table summarizes Master Bond's range of adhesive bonding products.

Product Description
EP21FRLVSP

Flame resistant, UL94V-O certified system. Exhibits excellent physical and electrical insulation properties. Designed for potting and encapsulating.

EP21LV This versatile, easy-to-use, two component potting compound possesses excellent electrical properties and a convenient one to one mix ratio.
EP30DP Toughened system with excellent shock resistance withstands thermal cycling and is easily repairable

 

Typical Applications for Master Bond Adhesive Bonding Systems

Typical applications of Master Bond's range of products for adhesive bonding products include:

  • Ovens
  • Cameras
  • Telephones
  • Air Conditioners
  • Refrigerators
  • Dishwashers
  • Washing Machines
  • Freezers and many more

Customized Packaging to Customer Specifications

Master Bond offers a wide array of packaging options to speed productivity, minimize waste and save energy including...

  • Quantities from grams to gallons
  • Cans, bottles and jars
  • Cartridges for manual and pneumatic guns
  • Premixed and frozen syringes
  • Bipaks for field service kits

New Epoxy Adhesives Developed For Appliance Manufacturing Companies by Master Bond

Product Description
EP112 Low viscosity, two component epoxy with exceptional electrical insulation properties. High bond strength. Long working life at room temperatures. Optically clear.
EP77M-F Silver filled epoxy adhesive has rapid setup time of 5-7 minutes at room temperature. Low volume resistivity and exceptional bond strength. Easy to use one to one mix ratio. Can be applied on vertical surfaces without dripping. Resists many chemicals.
EP79 Silver filled epoxy adhesive has rapid setup time of 5-7 minutes at room temperature. Low volume resistivity and exceptional bond strength. Easy to use one to one mix ratio. Can be applied on vertical surfaces without dripping. Resists many chemicals.
EP30P Low viscosity, room temperature curing epoxy offers excellent adhesion to glass, polycarbonates and acrylics. Bonds are rigid. High chemical resistant properties. Easy to apply

 

Electronic Grade Polymers for Electronic Manufacturing by Master Bond

Master Bond’s line of microelectronic formulations consists of epoxies, silicones, polyurethanes, acrylics and latex solutions. They include electrically insulative, thermally conductive and electrically conductive systems. Both one and two component compounds are available for use. These products are currently employed in applications ranging from heat sinking to glob tops to surface mounting. Many of these compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc. Master Bond is also actively engaged in developing new products to keep pace with the rapid technological advancements in the microelectronic industry ranging from flip-chip technology to advanced die-attach processes.

Master Bond offers specialty systems for computers, telecommunications devices, audio/video devices, avionics and aerospace applications, as well as automotive manufacturing, interactive circuitry and advanced semiconductor equipment.

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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