Juki Automation Systems (JAS), a company specializing in high-speed SMT assembly equipment, recently received an order for six modular assembly systems, two KE-2080 Mounters and four KE-2070 High-Speed Flexible Mounters from PRIDE Industries, a nonprofit organization and recognized service supplier.
STATS ChipPAC, a major provider of semiconductor packaging test, design, assembly and distribution solutions, has reported that its cutting-edge flip chip packaging technology called fcCuBE technology featuring improved assembly processes, bond-on-lead interconnection and copper column bumps is under large-scale production for numerous customers.
Research and Markets has reported the inclusion of a new report titled ‘Global Packaging Survey 2012-2013: Market Trends, Buyer Spend and Procurement Strategies in the Global Packaging Industry’ to its catalogue.
The Pittcon Exposition Committee is now accepting booth space reservations for Pittcon 2013, which will be held March 17-21, at the Pennsylvania Convention Center in Philadelphia, PA.
During the opening ceremony of the European Society of Glass Science and Technology conference conducted on June 4, 2012, in Maastricht, Corning’s Dr John C. Mauro has earned the first SGT – Alastair Pilkington Early Career Award for his work on the development and expansion of computer simulation applications in many facets of glass science.
International sustainable resins supplier, Cardia Bioplastics Limited, and leading rigid plastic packaging company, Alto Packaging, have announced a strategic partnership to produce high performance packaging solutions with environmental benefits.
Kaman Industrial Technologies (KIT), a subsidiary of Kaman, has acquired Miami, Florida-based Florida Bearings, a distributor of bearings, pump and power transmission products.
MarketsandMarkets has released a new research report titled ‘Polymethyl Methacrylate (PMMA) Market by Application, Grade & Form - Global Trends & Forecasts (2012 - 2017).’
Tokyo Electron U.S.’ subsidiary, TEL NEXX has declared a new joint development program with IBM in 3D semiconductor packaging.
BASF has announced that it has purchased Iowa-based ITWC, which specializes in polyester polyols and cast elastomer polyurethane systems.
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