Advanced materials company, AeonClad Coatings has reported the expansion of a new state-of-the-art research and development facility situated in Austin, Texas.
AREVA has signed three contracts with the German utilities RWE1 and EnBW2 for the supply of fuel assemblies.
The first two contracts signed with RWE cover the manufacture and the supply of ATRIUMTM and HTPTM 3 fuel as...
Alcoa has inked new multi-year supply contracts to supply its aerospace aluminum plate, sheet and hard alloy extruded products to Airbus. The products use Alcoa’s next-generation aluminum lithium alloys. Both the companies signed the contracts at the Farnborough Air Show, this week. The value of those agreements is considered to be about US$1.4 billion.
SGL Group’s subsidiary, HITCO Carbon Composites has reported that it has received a contract from Boeing Commercial Airplanes to manufacture and deliver 777 Empennage Rib Chords.
Bemis and Thin Film Electronics have reported that they have inked a joint contract to make a Bemis intelligent packaging platform. This joint agreement will expedite the commercial growth of functional sensor labels.
Arkema, a France-based chemical manufacturer, has declared a project to divest its tin stabilizer business to PMC Group, a New Jersey-based performance plastics and chemicals manufacturer.
Juki Automation Systems (JAS), a company specializing in high-speed SMT assembly equipment, recently received an order for six modular assembly systems, two KE-2080 Mounters and four KE-2070 High-Speed Flexible Mounters from PRIDE Industries, a nonprofit organization and recognized service supplier.
STATS ChipPAC, a major provider of semiconductor packaging test, design, assembly and distribution solutions, has reported that its cutting-edge flip chip packaging technology called fcCuBE technology featuring improved assembly processes, bond-on-lead interconnection and copper column bumps is under large-scale production for numerous customers.
Research and Markets has reported the inclusion of a new report titled ‘Global Packaging Survey 2012-2013: Market Trends, Buyer Spend and Procurement Strategies in the Global Packaging Industry’ to its catalogue.
The Pittcon Exposition Committee is now accepting booth space reservations for Pittcon 2013, which will be held March 17-21, at the Pennsylvania Convention Center in Philadelphia, PA.
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