SEMATECH, the global consortium of semiconductor manufacturers, today announced the appointment of Satyavolu Papa Rao as Director of Process Technology. In this key role, Papa Rao will serve as the operational lead, overseeing the strategic development of SEMATECH’s manufacturing, process, materials and ESH-related activities.
Dow Corning, a global leader in silicon and wide-bandgap semiconductor technology, today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects, such as micropipe dislocations (MPD), threading screw dislocations (TSD) and basal plane dislocations (BPD).
Samsung Electronics, Co., Ltd., a global leader in memory semiconductor technology, today announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips: 3D V-NAND.
Vishay Intertechnology, Inc. today introduced the industry's first 150 V n-channel MOSFET in the compact, thermally enhanced PowerPAK® SC-70 package. Offering the industry's lowest on-resistance at 10 V in the 2 mm by 2 mm footprint area, the Vishay Siliconix SiA446DJ is designed to increase efficiency by reducing conduction and switching losses in a wide range of space-constrained applications.
Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, semiconductor, and photovoltaic (solar) industries, announced today that X-FAB Sarawak Sdn. Bhd., part of The X-FAB Group, which is the world’s largest specialty fab group for analog/mixed signal silicon wafers, has selected the Eyelit Semiconductor Edition™ MES suite for its 200 mm wafer fabrication facility in Kuching, Sarawak, Malaysia.
Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, announces the addition of a manufacturing plant in Golden, CO. The new 35,200 sq. ft. facility has three cleanrooms: a 10,000 sq. ft. Class 10,000 cleanroom, a 4500 sq. ft. Class 1,000 cleanroom, and a small Class 100 cleanroom.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today announced that it has received Singapore's highly exclusive and prestigious honour, the Distinguished Partner in Progress (DPIP) award, in recognition of its strong leadership and outstanding contributions to the local semiconductor industry.
After using it to develop a computer chip, flash memory device and photographic sensor, EPFL scientists have once again tapped into the electronic potential of molybdenite (MoS2) by creating diodes that can emit light or absorb it to produce electricity.
NXP Semiconductors N.V. and DATANG TELECOM TECHNOLOGY CO., LTD today announced that they have been awarded a business license for their joint venture (JV) by the Chinese Government. This marks the establishment of China's first true automotive semiconductor business.
Mattson Technology, Inc., a leading supplier of advanced process equipment used to manufacture semiconductors, has expanded its etch market position with shipments to DRAM, 3D NAND and wafer level packaging fabs in the first quarter of 2014. These shipments are the result of new etch applications released for production on Mattson's paradigmE line of etch systems.
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