Global flexible electronics market is expected to reach $13.23 Billion by 2020 at an estimated CAGR of 21.73% with the number of applications using printing processes for flexible electronics forecast to grow at a good rate.
eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, today announced it has been granted two patents by the United States Patent and Trademark Office.
Averna will be exhibiting at NIWeek 2014, the industry's premier event on graphical system design, and participate in the opening keynote address. NIWeek 2014 begins August 4 at the Austin Convention Center in Austin, Texas, for three days of interactive technical sessions, case study presentations, and panel discussions on the latest advances in design, control, automation, manufacturing, and test.
FIME has announced that its Montreal-based laboratory has been qualified by Visa to perform testing for its 'contactless EMV analogue and digital' specifications. This latest qualification supports handset manufacturers by enabling the leading payments consultancy and advanced testing provider to confirm compliance of near field communication (NFC) enabled mobile devices to the functional requirements laid out by the payment system.
Orbotech Ltd. Orbotech Ltd., a global leader in advanced technology production solutions for flat panel display (“FPD”) manufacturing, announced today that TFT LCD panel maker Nanjing CEC Panda LCD Technology Co., Ltd. (a China Electronics Corp. company) has selected Orbotech as the inspection, testing and repair equipment vendor for its new Gen 8.5 fab in Nanjing, China.
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.
Reportbuyer.com has added a new market research report: Advanced Materials for Displays: Technologies and Global Markets
Tsinghua Unigroup Ltd., an operating subsidiary of Tsinghua Holdings Co., Ltd., a solely State-owned limited liability corporation funded by Tsinghua University in China, and RDA Microelectronics, Inc., a fabless semiconductor company that designs, develops and markets wireless systems-on-chip and radio-frequency (RF) semiconductors for cellular, connectivity and broadcast applications, today jointly announced the closing of the approximately US$907 million merger of RDA Microelectronics with an affiliate of Tsinghua Unigroup as contemplated by the previously announced agreement and plan of merger, dated November 11, 2013 and amended on December 20, 2013, between Tsinghua Unigroup and RDA.
GE’s Industrial Solutions business is investing an additional $1.3 million in its West Burlington plant as a manufacturing center of excellence and is creating about 50 new jobs.
Macnica Group, a leading global technical distributor for semiconductor and networking products, today announced release of its Mpression MIPI LCD Card. The card with a low power, high resolution TFT LCD connects with Altera® FPGA based development boards through HSMC connectors. Macnica is starting to ship the card from August 2014.
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