Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride on silicon (eGaN®) power FETs will be presenting three application-focused technical presentations at PCIM Europe. The conference will be held in Nuremberg, Germany from May 20th through the 22nd.
BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.
Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the company will showcase its line of high quality optical products for use in defense and aerospace, instrumentation and analytical processing, sensors and detectors, semiconductor process equipment, and medical and laser applications at the SPIE Defense, Security and Sensing 2014 exhibition from May 6 to 9 at the Baltimore Convention Center in booth #1032.
An enormous treasure slumbers in the depths of our planet. Temperatures of up to 7000 °Celsius are thought to be present in the Earth's core, while at a depth of four to six kilometers (2.5 to 3.5 miles) it is still 150 °C to over 200 °C. These gigantic reserves of heat can be used as a renewable source of energy for geothermal power.
The ever-increasing demands for miniaturization and higher functionality at less cost processes have driven the development of stacked ICs and System in Package (SiP) technologies. System in Package (SiP) is a single reduced functional module realized by the horizontal tiling or vertical stacking of two or more similar or dissimilar bare die or packaged chips.
Manganites – compounds of manganese oxides – show great promise as “go-to” materials for future electronic devices because of their ability to instantly switch from an electrical insulator to a conductor under a wide variety of external stimuli, including magnetic fields, photo-excitations and vibrational excitations.
Ioxus, a manufacturer of premium performance ultracapacitor technology for use in transportation, industrial and energy applications, today announced the opening of its second manufacturing facility in Oneonta, New York.
Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.
Transparent conductive films (TCFs) -- used in touchscreens -- and sensors are currently the hottest sectors in printed, flexible and organic electronics, based on an analysis of start-up companies' performance, according to Lux Research.
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP) manufactured using Deca's unique, integrated Autoline production platform, which is designed to achieve faster time-to-market at lower cost.
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