Freescale Semiconductor, the global leader in radio frequency (RF) power transistors, today introduced the first 2W integrated power amplifier operating with a 5V supply and delivering more than 40 dB of gain to cover all frequency bands between 1500 MHz and 2700 MHz. The component supports any cellular standard operating at this frequency including GSM, 3G, 4G and LTE.
Power management company Eaton today announced that it will invest in a new manufacturing facility in the Philippines for its electrical business to further expand its operations in the Asia Pacific market. A groundbreaking ceremony was held today, and was attended by representatives from government, local organizations and Eaton leadership.
University of Utah electrical engineers fabricated the smallest plasma transistors that can withstand high temperatures and ionizing radiation found in a nuclear reactor. Such transistors someday might enable smartphones that take and collect medical X-rays on a battlefield, and devices to measure air quality in real time.
EpiGaN nv, a leading provider of III-nitride epitaxial materials, was awarded the title of National Trends Gazelle Ambassador 2014 in the category ‘Starter’ by Trends, a leading financial-economics Belgian magazine.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Yamaha Corporation (Yamaha) utilized components of the Cadence® Low-Power Solution to achieve a 50 percent reduction in leakage power in its newest chip for smartphones.
Research and Markets has announced the addition of the "Test and Measurement in the Global Electronics Manufacturing Services Market" report to their offering.
This week Linde LienHwa (LLH) China, a joint venture between The Linde Group and Taiwan MiTac Group, will be exhibiting at SEMICON China 2014 at the Shanghai New International Expo Centre (SNIEC). Exhibiting at the largest microelectronics industry event in China, serving the Semiconductor, Flat Panel Display (FPD), LED, MEMS, and related technology markets, LLH will showcase the Group’s portfolio of gases and services in electronics manufacturing at Hall N1, booth #1443.
Spansion Inc., a global leader in embedded systems solutions, has been awarded Huawei Green Certification in recognition of Spansion's ability to ensure product content and manufacturing processes meet or exceed Huawei's stringent green requirements. The certification is given following a strict qualification process and is valid for two years.
CERADROP is happy to present advances made in Materials Deposition Inkjet Systems with integrated post processing for Printed Electronics and Smart 3D Printing, carrying out printing demonstrations in collaboration with ArjoWiggins Creative Papers.
Xilinx, Inc. today announced availability of the industry's first high performance DDR4 memory solution for All Programmable UltraScale™ devices running at 2400 Mb/s. Based on an ASIC-class architecture, the UltraScale devices support massive I/O and memory bandwidth with dramatic power and latency reduction.
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