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Imec Announces Cryogenic Etching Method to Protect Surface of Porous Ultralow-k Dielectrics

Imec today announced a cryogenic etching method that protectsthe surface of porous ultralow-k dielectrics against excessive plasma induced damages.

From IMEC 10 Jul 2013

See the World's Smallest Telecentric Lens System for Machine Vision from SCHOTT at Semicon West

SCHOTT, the international technology group and experts in the fields of specialty glass and glass-ceramics, will showcase a range of lighting and imaging components at Semicon West that can advance production processes f...

From SCHOTT UK Ltd. 9 Jul 2013

Vishay Intertechnology to Exhibit Latest Products at Techno-Frontier 2013

Vishay Intertechnology, Inc. today announced that it will be exhibiting its latest semiconductors and passive components in booth 1D-207 at Power System Japan, a focused exhibition on power systems at Techno-Frontier 2013, being held at the Tokyo Big Sight from July 17 to 19, 2013.

4 Jul 2013

Fujitsu Semiconductor’s SoC Solution Utilizes ARM Technology

Fujitsu Semiconductor Limited and ARM today announced a licensing agreement that enables Fujitsu Semiconductor to release a system on chip (SoC) solution which takes advantage of the benefits of ARM big.LITTLE™ technology and ARM Mali-T624 graphics processing.

3 Jul 2013

EPSRC Opens National Centre of Excellence for Power Electronics

The UK’s capacity in power electronics, a technology that underpins and is vital to many of the country’s industries and its economy, received an £18 million boost today from the Engineering and Physical Sciences Research Council (EPSRC) with the opening of the first EPSRC National Centre of Excellence for Power Electronics.

3 Jul 2013

New Broad-Ranging Report on Supercapacitors and Supercabatteries

Reportlinker.com announces that a new market research report is available in its catalogue: Electrochemical Double Layer Capacitors: Supercapacitors 2013-2023

From Report Linker 29 Jun 2013

Advantest Introduces T2000 Platform with 8Gsps Waveform Generator and 8GHz Digitizer Module for SoC Testing

Leading semiconductor test equipment supplier Advantest Corporation today introduced its new T2000 8GWGD instrument, incorporating an 8-giga-samples-per-second (Gsps) waveform generator and an 8 GHz digitizer into a module for testing system-on-chip (SoC) devices used in mass-storage devices, including hard disk drives (HDDs).

From Advantest Corporation 27 Jun 2013

Materion Expands Production Capability to Meet the Growing Demand for LED Phosphor Materials

Savvy consumers are being driven to replace current household light bulbs with light-emitting diodes (LED) to reduce energy consumption and costs. This shift away from traditional lighting has caused the LED market to double between 2006 and 2011 with growth projected to continue.

27 Jun 2013

Synopsys to Join A*STAR Institute of Microelectronics-led 2.5D Through-Silicon Interposer Consortium

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that it will join Singapore's A*STAR Institute of Microelectronics (IME)-led 2.5D TSI Consortium to provide the framework for heterogeneous 3D-IC systems using through-silicon interposer (TSI) technology.

25 Jun 2013

Hermetically Sealed Tantalum Polymer Chip Capacitors for Aerospace Applications from AVX

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has announced the availability of its new TCH Series hermetically sealed tantalum polymer chip capacitors for aerospace and other high-reliability applications. Featuring conductive polymer electrodes, TCH Series capacitors exhibit very low ESR and low derating capabilities in addition to high ripple current, high capacitance (1.5-680µF), and the highest voltages (10-100V) of any space-grade SMD tantalum polymer capacitor currently available on the market.

24 Jun 2013

Editorial Highlights

The Material Breakthroughs Revolutionizing Photovoltaics

Photovoltaic technology is revolutionizing sustainable energy with advancements in perovskite cells and innovative recycling methods for eco-friendly solutions.

Emerging Technologies and Trends in the Aerospace Industry

The global economy depends on the aerospace industry, and the technological advancements the aerospace industry has to offer are immense. This article aims to delve into the fascinating world of aerospace and explore the most promising trends and technologies that the industry is developing. How will they pave the future of air travel, and will they make it safer, more sustainable, and more efficient?

Microporous Polymers and Their Applications

Microporous polymers, with their unique structures and properties, are revolutionizing gas storage, carbon capture, and catalysis in various scientific fields.

Electronics News

Imec Announces Cryogenic Etching Method to Protect Surface of Porous Ultralow-k Dielectrics

See the World's Smallest Telecentric Lens System for Machine Vision from SCHOTT at Semicon West

Vishay Intertechnology to Exhibit Latest Products at Techno-Frontier 2013

Fujitsu Semiconductor’s SoC Solution Utilizes ARM Technology

EPSRC Opens National Centre of Excellence for Power Electronics

New Broad-Ranging Report on Supercapacitors and Supercabatteries

Advantest Introduces T2000 Platform with 8Gsps Waveform Generator and 8GHz Digitizer Module for SoC Testing

Materion Expands Production Capability to Meet the Growing Demand for LED Phosphor Materials

Synopsys to Join A*STAR Institute of Microelectronics-led 2.5D Through-Silicon Interposer Consortium

Hermetically Sealed Tantalum Polymer Chip Capacitors for Aerospace Applications from AVX

Breaking Boundaries in Ceramic Machining with Internal Threading Innovation

Analytical Techniques Reveal History’s Tracked Changes

Beyond Lithium-Ion: Engineering the Future of Battery Technology

Improve Plastic Pipe Testing Accuracy With ATS Ring Pull Fixtures

HTF Fluid for Extreme Conditions

Maximize Efficiency in Semiconductor QA with the Dimension IconIR300

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How Sigma WinCCS Became the Global Standard for Creep and Stress Rupture Testing

Guide to Metal and Alloy Sorting

Enhancing Environmental Testing Through ETHOS EASY Laboratory Flexibility

Temperature Calibration in UHT Milk Production

Editorial Highlights

The Material Breakthroughs Revolutionizing Photovoltaics

Emerging Technologies and Trends in the Aerospace Industry

Microporous Polymers and Their Applications

Electronics News

Breaking Boundaries in Ceramic Machining with Internal Threading Innovation

Analytical Techniques Reveal History’s Tracked Changes

Beyond Lithium-Ion: Engineering the Future of Battery Technology

1Banana Peels Power New Green Route to High-Performance Lithium-Ion Batteries

2Unlocking Solar Efficiency with a Breakthrough in Passivation

3New Insights into Perovskite Solar Cell Failure Pathways

4Processing Lignin Differently Could Dramatically Change its Electrical Properties

5Martian Homes Will be Made From Soil and Spirulina

6KTU Researchers Develop Sustainable Smart Polymers for Medicine, Electronics, and Optics

Sponsored Content

Editorial Highlights