Savvy consumers are being driven to replace current household light bulbs with light-emitting diodes (LED) to reduce energy consumption and costs. This shift away from traditional lighting has caused the LED market to double between 2006 and 2011 with growth projected to continue.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that it will join Singapore's A*STAR Institute of Microelectronics (IME)-led 2.5D TSI Consortium to provide the framework for heterogeneous 3D-IC systems using through-silicon interposer (TSI) technology.
AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has announced the availability of its new TCH Series hermetically sealed tantalum polymer chip capacitors for aerospace and other high-reliability applications. Featuring conductive polymer electrodes, TCH Series capacitors exhibit very low ESR and low derating capabilities in addition to high ripple current, high capacitance (1.5-680µF), and the highest voltages (10-100V) of any space-grade SMD tantalum polymer capacitor currently available on the market.
Research and Markets has announced the addition of the "Silver Inks and Pastes Market - 2013" report to their offering.
Entegris, Inc., a leader in contamination control and materials handling solutions and 3S Korea Co., Ltd., a leader in wafer shipping solutions, announced today their partnership for the sale of 450 mm wafer handling products to customers in Korea.
ESCATEC, the Electronics Manufacturing Services innovator, has announced its membership of the United Nations Global Compact, the ten principles of which cover human rights, labour standards, the environment and anti-corruption.
Jackets with built-in mobile phones, sports clothes that warn you when your heart rate gets too high, wallpaper with glowing patterns—these are not concepts from a science fiction movie, some of them are actually already available, and they may soon become commonplace. These applications require electrically conductive fibrous materials. Korean researchers have now developed a new process for rendering paper and textile fibers conductive with aluminum. Their report appears in the journal Angewandte Chemie.
Vishay Intertechnology, Inc. today extended its VJ automotive series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high-temperature automotive applications. To save board space, the VJ….31 / VJ….34 now offer a 0402 case size with an X8R dielectric. In addition, the 0603 and 0805 case sizes featuring an X8R dielectric have been enhanced, now offering working voltages of 100 V.
Research and Markets has announced the addition of the "2013 Deep Research Report on Global and China LED Wafer Industry" report to their offering.
eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC's 28nm process.
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