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EPFL Spin-Off Kandou Bus Earns Academic Enterprise Award for Chip-to-Chip Serial Links

EPFL Spin-Off Kandou Bus Earns Academic Enterprise Award for Chip-to-Chip Serial Links

Dow Corning Introduces Two New Products to its Thermal Interface Materials Line

Dow Corning Introduces Two New Products to its Thermal Interface Materials Line

IBM Debuts Latest SiGe Chip-Making Technology for High Performance Communications

IBM Debuts Latest SiGe Chip-Making Technology for High Performance Communications

Market Scale of China's Automotive Electronics Increases to CNY 320 Billion in 2012

Market Scale of China's Automotive Electronics Increases to CNY 320 Billion in 2012

DisplayLink Introduces DL-4000 Family of USB Monitor Chips for Green Monitors at Computex

DisplayLink Introduces DL-4000 Family of USB Monitor Chips for Green Monitors at Computex

ON Semiconductor Honors Dow Electronic Materials with Perfect Quality Gold Award

ON Semiconductor Honors Dow Electronic Materials with Perfect Quality Gold Award

Printed Electronics Europe 2014 Dates Announced by IDTechEx

IDTechEx Forecast Competition Between OLED and LED Technologies for the Next Decade

IDTechEx Forecast Competition Between OLED and LED Technologies for the Next Decade

Momentive Performance Materials Opens Expanded Technology Center in Korea for Electronics Research

Momentive Performance Materials Opens Expanded Technology Center in Korea for Electronics Research

Dongbu HiTek Establishes Offices in Mainland China to Address Growing Chinese Fabless Market

Dongbu HiTek Establishes Offices in Mainland China to Address Growing Chinese Fabless Market

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