Materials scientists from MIT and Boston College are developing a novel nanotechnology design to increase the electrical conductivity of a bulk alloy semiconductor such as Silicon Germanium (SiGe) by 30 to 40%.
Toshiba has reported that the company will reconstruct its semiconductor manufacturing plant in Thailand. Toshiba Semiconductor Thailand (TST) will be relocated to a new manufacturing unit.
A new semiconducting material, known as graphene monoxide (GMO), has been discovered by a research team from the University of Wisconsin-Milwaukee (UWM).
The Information Network has published a new report titled ‘The Global Market for Equipment and Materials for IC Manufacturing.’
Using a neutron scattering technique, researchers from the Institut Laue-Langevin (ILL) have performed a study on two-dimensional fermion liquids and identified a new type of density wave with very short wave-length.
Researchers from the Department of Materials Science at the University of Cambridge and Optoelectronic Research Centre at the University of Southampton have conducted a study on the phase change memory materials using advanced equipment and MEMS sensors.
MEI, a diversified manufacturing and service company serving the solar, semiconductor, and high technology industries, announced that its Pura wet processing system has achieved a major milestone to produce high-purity polysilicon. This ultra-pure electronic-grade material is suitable for high efficiency solar cell and semiconductor production.
An Environmentally Benign Manufacturing research team led by Tim Gutowski, a professor of mechanical engineering at the Massachusetts Institute of Technology (MIT), is working on the environmental impacts and costs associated with advanced material manufacturing.
Headquartered in Bernin, France, Soitec has been awarded new certifications from the Occupational Health and Safety Assessment Series (OHSAS) and the International Standards Organization (ISO) based on the audit carried out at the end of 2011.
GLOBALFOUNDRIES disclosed that the company's Fab 1 located in Dresden, Germany has supplied 250,000 semiconductor wafers using 32 nm high-k metal gate (HKMG) technology. This is a major landmark representing the company's competitive edge over other foundries using HKMG technology and its ability to ramp advanced technologies to mass production.
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