Posted in | Packaging

Intel Opts for Lead Free

Intel Corporation has announced it will begin eliminating approximately 95 percent of the lead used in its processors and chipsets starting later this year. The company is taking these significant steps to remove lead from its product packaging in order to make it more environmentally friendly.

Intel will begin shipping the lead-free technology with select microprocessors and chipsets in Q3, 2004, and embedded IA processors in Q2, 2004. The company shipped its first lead-free memory chips last year. Additional products will be transitioned as manufacturers become able to handle them. The new packages use lead-free solder balls, about the size of salt crystals, and represent the majority of lead used in Intel microprocessor packaging. Intel is working with the industry to find a reliable solution for the tiny amount of lead still needed inside the processor packaging to connect the actual silicon "core" to the package.

The transition to lead-free is a massive industry-wide effort with many technological, logistical and economic challenges. Since 2000, Intel has been working with industry consortia and the European Union's Restriction of Hazardous Substances (RoHS) legislation committee to come up with a solution that can be used around the world. To achieve this, the company developed reference procedures on its own research assembly lines to aide customers implement lead-free technology in their manufacturing process.

"Intel shipped millions of lead-free Flash Memory components in 2003. Today's announcement is the next major step on the road to a lead-free product line for Intel's high volume CPU and chipset product lines," said Nasser Grayeli, Intel vice president and director of assembly technology development, Technology and Manufacturing Group. "Our goal has been to develop a total solution that addresses the needs and concerns of our customers and suppliers, from the package materials to motherboard manufacturing. By doing this, our customers will be able to launch platforms with the new lead-free technology in the second half of 2004."

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