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SDK Group to Produce SPALF(TM) Packaging Material for Large-Scale LIBs

Showa Denko Packaging Co., Ltd. (SPA), a consolidated subsidiary of Showa Denko K.K., has developed a new product for its SPALF(TM) line of aluminum laminate films for packaging small-scale pouch type lithium-ion batteries (LIBs).

From Showa Denko KK 24 Mar 2020

Brewer Science Introduces its First Permanent Bonding Material this Week at the European 3D & Systems Summit

Brewer Science, Inc., is proud to introduce our first material for permanent bonding from the European 3D & Systems Summit.

From Brewer Science 28 Jan 2020

New Ultrasonic Coating System Advances Spray-On EMI Shielding Capabilities

Sono-Tek Corporation announces the release of a new ultrasonic coating system, the FlexiCoat EMI, specifically designed for conformal spraying of EMI (Electromagnetic Interference) shielding material onto semiconductor packages.

From Sono-Tek Corporation 17 Jan 2020

Covestro Offers Tear-resistant Polycarbonate Films for Breast Implant Packaging

Covestro has announced that it is particularly focused on premium packaging materials for high value medical devices that meet increased requirements for mechanical protection, sterilization and dimensional stability.

From Covestro 20 Dec 2019

INEOS Styrolution Offers SMMA Grades for Food Contact Applications

INEOS Styrolution has announced that its NAS® range is an excellent material of choice for food contact applications. Sparkling clarity, flowability, ease of processing, thermal stability, scratch and alcohol resistance are some of the key properties of NAS, an SMMA (styrene-methyl-methacrylate) grade.

From INEOS Styrolution Group GmbH 12 Dec 2019

Beckhoff Wins Food Processing Award

Beckhoff Automation, the industrial PC provider, was awarded best “Process & packaging solution or project” award for its eXtended Transport System (XTS) Hygienic at the 2019 Food Processing Awards held in Coventry.

From Beckhoff Automation GmbH 20 Nov 2019

Indium Corporation Expert to Present at EPTC

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging.

From Indium Corporation 7 Nov 2019