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ANDA iJet Tabletop Fluid Dispensing System

Anda Technologies USA, Inc., a leading provider of fluid application and custom design manufacturing equipment, features a line of precision high-performance fluid dispensing and underfill systems. iJet-Table Dispenser Models 250 & 350 are useful for many applications such as SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, as well as flat panel assembly.

From Anda Technologies USA, Inc. 20 Aug 2018

Researchers Develop Material Similar to Plastic Packaging from Crab Shells and Cellulose

Consumer products are boosting their sustainable & renewable origins. A new material has been developed from crab shells & cellulose.

27 Jul 2018

Investigations are Ongoing to Find the Optimal Next-Generation Bioplastics

The innovation under progress in the field of packaging is making products entirely using organic materials acquired from the remnants of agricultural production. A specialist at the Italian National Research Council (CNR) stated that such bioplastics might be as competitive as conventional ones in the early 2020s, although they might not be applicable in all fields.

5 Jul 2017

Aquapak Polymers Receives CleanTech Award for Flexible Plastic Packaging Films

Birmingham-based plastics manufacturer Aquapak Polymers has won a CleanTech award for ‘Responsible Product’ at this year’s Rushlight Awards.

6 Feb 2017

Arabplast 2017: Efficient Production of Packaging Items

From 8 to 10 January 2017, Arburg will be presenting its new electric entry-level machine series in the Middle East for the first time, at the Arabplast 2017 in Dubai (United Arab Emirates): an Allrounder 570 E Golden Electric will produce closure caps for drinking yoghurt bottles on stand D110 in Hall 5. Thanks to its consistent standardisation, the electric entry-level machine offers an excellent price/performance ratio.

From Arburg GmbH 22 Nov 2016

K 2016: Coperion Introduces FFS Packaging Machine ITL 250 with Automated Features

Coperion introduces the latest developments in its bagging and palletizing portfolio at K 2016 at its booth B19 in hall 14. Visitors will be able to see the completely re-designed FFS packaging machine ITL 250.

From Coperion GmbH 3 Oct 2016

Cadence Announces Availability of Integrated System Design Solution for TSMC’s InFO Packaging Technology

Cadence Design Systems, Inc. today announced the immediate availability of an integrated system design solution for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology, resulting from a collaboration between Cadence and TSMC that was announced earlier this year.

22 Sep 2016

Packaging News

ANDA iJet Tabletop Fluid Dispensing System

Researchers Develop Material Similar to Plastic Packaging from Crab Shells and Cellulose

Investigations are Ongoing to Find the Optimal Next-Generation Bioplastics

Aquapak Polymers Receives CleanTech Award for Flexible Plastic Packaging Films

Arabplast 2017: Efficient Production of Packaging Items

K 2016: Coperion Introduces FFS Packaging Machine ITL 250 with Automated Features

Cadence Announces Availability of Integrated System Design Solution for TSMC’s InFO Packaging Technology

Michelman to Highlight Printing and Coating Technologies at 5th Specialty Films & Flexible Packaging Conference

Picosun Drives Innovation in Chip Packaging

Micro-Epsilon UK Launches Inline High Speed Colour Measurement System, colorCONTROL ACS700

Nexsa - Unparalleled Sensitivity for Large & Small Area Analysis

Experts in polymer characterization and particle sizing, where is the next step?

Digital Microscopes for Automotive Inspection

Tooling Foam Board - LAST-A-FOAM® FR-4800

Cutting for Surface Preparation Applications with the IP60-150

Automated Hydraulic PressPRO

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1 A Revolutionary Method to Fabricate Battery Electrodes Using Aerosol Jet 3D Printing

2 Adding Photosensitizers to Polymer Powders to Enable Low-Cost, Colorful 3D Printing

3 Scientists Improve Performance Quality of Perovskites

4 MIT Mathematicians Solve Age-Old Spaghetti Mystery

5 Microscale Superlubricity Could Lead to Better Electromechanical Devices

6 ZEISS introduces machine learning capability for microscopy

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