Aug 15 2002
Intel Corp., who already have the most advanced semiconductor manufacturing process, have just unveiled more technological breakthroughs that they plan to integrate into volume manufacturing next year.
The new 90nm process will bring together several technologies never before seen in a single chip. These include higher performance, lower power transistors, strained silicon, high speed copper interconnects and a new low-k dielectric material.
The new 90nm process is the next step on from the 130nm process, which many chip manufacturers are only just embracing. Intel’s new process is also significant as they have moved from 200mm wafers (the norm for the 130nm process) to 300mm wafers for the 90nm process.
The new process also features 50nm transistors, the smallest ever, highest performing CMOS transistors in production. The smallest currently available are 60nm, and are also manufactured by Intel and used in their Pentium processors.
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