Nov 10 2005
Applied Materials, Inc. has been honored with a 2005 "Best CVD (chemical vapor deposition) Product" award by Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest dedicated chipmaking foundry, at TSMC's annual Supply Chain Management Forum in Hsinchu, Taiwan. The Applied Producer CVD systems, which conform to TSMC's policy of cost-effectiveness, achieved a top score in each field based on a very challenging set of criteria to win this award.
Dr. Wei-Jen Lo, vice president of Operations II, TSMC, said, "CVD systems are one of the most critical and widespread technologies used in the fab, since they are employed many times throughout the chip manufacturing process. We chose Applied Materials' CVD equipment as a 2005 Best Product after a careful evaluation of its leading-edge technologies and contribution to our production capabilities. TSMC greatly appreciates Applied's ongoing dedication to improving tool productivity, defect reduction and the overall advanced manufacturing capability of our company."
Applied Materials' Producer PECVD(1) systems deposit a wide range of advanced transistor and interconnect dielectric films in TSMC's production chips. As a world leader in the use of low k dielectric films to boost device speed and reduce power consumption, TSMC was one of the first chipmakers to introduce Applied's Black Diamond low k films to production.
"We are honored to receive this award from a world-class company like TSMC," said Dr. Farhad Moghadam, senior vice president and general manager of Applied Materials' Thin Films Product Business Group. "Working closely with TSMC to meet its constantly evolving goals for process technology, productivity, yield and product extendibility allows us to improve our products and provide the most advanced CVD technology to help enable their continued success."
http://www.appliedmaterials.com/