MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.
Pictured above, MIRTEC and YXLON equipment are on display at the Comet Group Lab ONE facility in San Jose, California. This new ‘Center of Excellence’ gives customers the opportunity to enjoy hands-on experience and demonstrations with MIRTEC’s latest Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) Systems in conjunction with YXLON’s State-of-the-Art Automated X-Ray Inspection (AXI) Technology. These systems are fully integrated with the Award Winning SmartLoop yield improvement system.
MIRTEC, together with YXLON, have delivered a game-changing Industry 4.0 solution. SmartLoop links MIRTEC’s in-line 3D AOI with the YXLON’s at-line digital X-Ray system, allowing data to flow between them seamlessly. Keith Bryant, YXLON Global Director of Electronics Sales stated, “3D AOI can only measure differences in Z-height on devices like BGAs and make a guestimate as to the quality of the joints underneath and the need for rework. With SmartLoop, the at-line X-Ray system now becomes a verification station for the 3D height measurements taken by the AOI system. X-Ray inspection time is also dramatically reduced by targeting only suspect regions of interest that the system automatically selects for inspection. Full data integration gives the technician the tools needed for correct decisions, intelligent feedback and process improvements.”
Brian D’Amico, President of MIRTEC’s North American Sales and Service Division stated, “We are very excited to partner with YXLON and the Comet Group. Our intention is to collaborate on new inspection solutions for the Electronic Manufacturing Industry, combining the strengths of MIRTEC’s Award Winning 3D Inspection Technology with YXLON International’s advanced X-ray and CT inspection systems. These new solutions will provide our valued customers with leading-edge inspection capabilities required in the production of complex electronic assemblies and help pave the way toward Industry 4.0 through collaborative data integration. We look forward to a long and prosperous relationship between our organizations”