SET Corporation SA

SET Corporation SA

Address
131, impasse Barteudet
Saint Jeoire
74490
France
Phone: +33 450 35 83 92
Fax: +33 450 35 88 01
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SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die Bonders/Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

As a supplier of semiconductor equipment dedicated to high precision applications for over 40 years, SET has developed more than 34 different types of equipment. With more than 300 Device Bonders installed worldwide in more than 30 countries, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders.

First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

SET, Smart Equipment Technology, Introduces New Automatic Flip-Chip Bonder Dedicated to Device Production

SET, Smart Equipment Technology, Introduces New Automatic Flip-Chip Bonder Dedicated to Device Production

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Editorial Highlights

The Current State of the Global Semiconductor Market

The Current State of the Global Semiconductor Market

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How are Graphene Batteries Made?

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.