Especially for fast flow measurements and wire bonding assembly, the Flow Sensor MFS 02 was developed. Due to a membrane system the thermal mass is reduced to the minimum. Very fast response time and low power consumption are resulting from this little thermal mass.
The membrane is just a few microns thick and is carried by a glass substrate. Therefore the system is robust and the device can be handled easily.
Advantages of MFS 02 Flow Sensor
The advantages of
MFS 02 Flow Sensor include:
Fast response time
Small mass flow rates
Detection of flow direction
Low power consumption
Small thermal mass
Best price-performance ratio
Applications of MFS 02 Flow Sensor
Differential pressure sensors
MEMS-Manufacturing Process –F O T U R A N
Final sensor element
MEMS-Manufacturing Process –Sensor Structures
Photo structured glass substrate with membrane -polymere dot
Spin coating prozess
Sputtering thin film platinum
Photolithographic mask process
Ion based etching process
Sensor Application –Chip Layouts and Circuits
Different resistor arrangements and values depending on flow application
Customized sensors possible because of inexpensive mask processes
Simple resistive structure for using in CTA -mode
Using as full bridge with Constant voltage or current supply Flow direction sensitive
Using as full bridge in a CTA; Flow direction sensitive
Sensor Application –Thermal Sensor Properties
Simple full bridge calorimeter mode Sensor supply 3mA and about 2,5 volts Flow rate 0,00 mlN/min
Simple full bridge calorimeter mode Sensor supply 3mA and about 2,5 volts Flow rate 200 mlN/min
Full bridge calorimeter mode and CTA biasing Sensor supply 4mA and about 3,5 volts Flow rate 600 mlN/min
Sensor Application –Measuring Properties
Unamplified nominal sensitivity 3mV/ mlNmin
-1 In zero cross point Physical flow range enlargement by full bridge mode with CTA biasing
No cool down effect of heater with CTA biasing.
Heating power 10mW to 50mW
Stable zero cross point; independent on any drift effects like contamination.
High flow CTA mode-range
Sensor Application –Assembly Possibilities
Easy to use and robust sensor construction
PCB integration by mounting in a cavity or hole
Connecting by wire bonding or soldering
Backsite mounting of flow channel
Sensor mounted in a separate flow channel
wire bonded flow sensor for pcb connection
Pick & place assembling of sensor possible
Plug and play module by USB interface
Example with the wire bonding sensor type
MFS02 together with an ASIC on a pcb.
This information has been sourced, reviewed and adapted from materials provided by Innovative Sensor Technology, USA Division.
For more information on this source, please visit
Innovative Sensor Technology, USA Division.