Adhesives, Sealants, and Coatings for Semiconductor Assembly Applications

Master bond is leading the way in semiconductor packaging with a complete line of underfill, die attach, glob top and encapsulation compounds. These systems are designed for easy processing and dependability. Specific grades feature high purity, outstanding resistance to water and chemicals, thermal stability and low stress.

The evolution of product development in semiconductor packaging has created new challenges to optimize performance. In order to meet these new stringent requirements, Master bond has utilized the latest, most advanced polymeric materials. These compounds are specifically designed to simplify manufacturing and deliver high reliability. Each product is formulated to meet exact customer specifications and to ensure cost effective solutions.

Properties of Master Bond Epoxy Systems for Semiconductor Applications

Master Bond custom formulates epoxy compounds to meet the specific demands of the semiconductor packaging industry. Specific grades offer exceptional mechanical, electrical, thermal and optical properties, including:

  • Thermal conductivity
  • Electrical insulation
  • Dimensional stability
  • Electrical conductivity
  • Superior toughness
  • High flexibility
  • Low shrinkage

Master Bond also offers compounds that remain serviceable even in the most adverse environmental conditions. Special grades offer:

  • Serviceability in extreme temperatures
  • Superior bond strength
  • Resistance to thermal cycling
  • Snap cures
  • B-stageable
  • Low outgassing
  • Ultra low moisture absorption
  • Low CTE
  • Stress absorption

Applications of Master Bond’s Semiconductor Adhesives

Master Bond's epoxy systems can be applied in many different semiconductor applications, including:

  • Passive components
  • Discrete components
  • BGA/CSP
  • QFN
  • SOIC/SOP
  • Flash/DRAM
  • Optics

Most Popular Epoxies for Semiconductor Applications

Products Application Description
EP21AO Thermally conductive A two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. Will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics.
UV15X-2GT Glob top One part, UV curable epoxy with ultrafast curing. Good physical strength properties and chemical resistance.
EP30FL Potting and encapsulation Low viscosity, optically clear epoxy. Ideal for thermal cycling and sensitive components. Has a room temperature or low elevated temperature cure.
EP79 Electrically conductive Cost effective alternative to silver-filled epoxy with a silver-coated nickel filler. Excellent conductivity and physical properties.
EP3RRLV Flip-chip underfill One part oven cured underfill encapsulant. Good dimensional stability and very easy to use. Cures rigid.
EP21TCHT-1 Thermally conductive NASA low outgassing certified, high temperature resistant, thermally conductive epoxy. Cryogenically serviceable.
EP37-3FLFAO Thermally conductive For potting & bonding. Good thermal conductivity. Cures flexible. Meets NASA low outgassing certification. Cryogenically serviceable.
SUPREME 10HT/S Die Attach One part, electrically conductive epoxy with low resistance. Excellent strength properties. Cures at 125-150°C. Meets NASA low outgassing specifications and offers superior temperature resistance.
EP37-3FLF Low stress Two part room temperature curable epoxy with superb flexibility. Widely used for potting and encapsulation where low stress on sensitive components is desirable. High optical clarity.

Packaged the Way You Need It

We offer a wide array of packaging options to speed productivity, minimize waste and save energy including...

  • Quantities from grams to gallons
  • Cans, bottles and jars
  • Cartridges for manual and pneumatic guns
  • Premixed and frozen syringes
  • Syringe Applicators

This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.

For more information on this source, please visit Master Bond Inc.

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