Equipment | Coating Deposition |Atomic Layer Deposition Systems

Atomic Layer Deposition Systems

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Atomic layer deposition (ALD) is a process used to deposit a wide variety of thin film materials from the vapor phase of matter. The system involves alternating pulses of gaseous precursors that interact with a substrate. First, a precursor is pumped into a vacuum chamber to allow it to completely react with the substrate surface so that lays down exactly one monolayer. After the layer is deposited, the chamber is cleared with an inert carrier gas to get rid of any unreacted precursor or by-products. A counter-reactant precursor is then pulsed into the chamber to create another layer. This process is then cycled until the proper film density is reached.

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