Nordson MARCH, a Nordson Company, a global leader in plasma processing technology, will present the paper “Overcoming the Challenges Presented with Automated Selective Conformal Coating of Advanced Electronic Assemblies by Employing Plasma Treatment Technology,” by David Foote, global applications manager, Nordson MARCH, at SMTA International 2013, Fort Worth, TX, Tuesday, October 15, from 4:00–5:30 PM, in Technical Session MFX3, Room 202D.
Novelis, the world leader in aluminum rolling and recycling, announced today the completion of a two-year, $400 million expansion program in South Korea. The expansion of its Yeongju and Ulsan plants increases the company's production capacity in the region by more than 50 percent to approximately one million metric tons of aluminum sheet per year.
Bre Pettis, CEO of MakerBot, and the global leader in the desktop 3D printing industry, was the featured guest speaker at this week’s meeting of the National Additive Manufacturing Innovation Institute, formerly known as NAMII, and now known as America Makes, held October 8, 2013, in Youngstown, Ohio.
Indium Corporation introduces a new,high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0)materialis especially suited for assembly processesin which the components don’t allow for proper outgassing of volatized flux.
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.
The Siemens Industry Automation Division has equipped the Simit simulation framework for the virtual commissioning of Simatic-based automation solutions with new functions in version 7.1. The Simit Contec library was added to the pre-assembled software components and models.
At this year's SPS IPC Drives automation trade fair, Siemens will be supplying answers to the current and future challenges facing manufacturing industry under its trade fair banner "Making Things Right". "Our aim this year is to illustrate to visitors how to improve their production – from design, through engineering and operation to maintenance", explains Heinz Eisenbeiss, Director of the Siemens booth at this year's show.
Printed circuit boards for consumer electronics are like a city skyline. With limited real estate to build across a neighborhood block, developers build up, story-upon-story. Memory chips and logic devices are being stacked in a similar fashion on circuit boards the size of credit cards as a way to increase power and performance across the board’s “real estate.”
The Wayne State University College of Engineering will host lab tours as part of the American Society of Mechanical Engineers (ASME) 2013 Internal Combustion Engine Fall Technical Conference, set for Oct. 13-16 in Dearborn. The tours will be held for conference participants starting at 8:40 a.m. on Wednesday, Oct. 16.
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