In a move to strengthen its position as a leading supplier in the LCD marketplace, Tianma Microelectronics Co., Ltd., Shenzhen, China, has completed the acquisition of its five production lines in Japan, Shenzhen, Shanghai and Wuhan, and increased its investment in its Chengdu facility.
Toshiba Corporation today announced that it will showcase its latest NAND flash and storage products at Flash Memory Summit, the world’s largest flash memory conference, which will be held from August 5 to 7 at the Santa Clara Convention Center in Santa Clara, California, USA.
CSR plc, a leading provider of multifunction connectivity, audio, automotive and location platforms, today announces it has signed a distribution agreement with Future Electronics (Future), a leading global distributor of electronic components.
Molex Incorporated announces the launch of its new SlimStack™ SSB6 SMT microminiature board-to-board connectors.
Dow scientists, who led the development of an advanced microchip technology that enabled high-volume semiconductor manufacturing across multiple generations were named 2014 “Heroes of Chemistry,” a prestigious award given by the American Chemical Society (ACS).
Mouser Electronics today announced the upcoming release of MultiSIM BLUE, the NI Multisim Component Evaluator – Mouser Edition. In collaboration with NI, the new Mouser version of the free tool will add features and functionality to provide engineers with an industry-standard SPICE simulation environment of electronic circuits using Mouser Electronics’ distributed components.
Keithley Instruments, Inc., a world leader in advanced electrical test instruments and systems, today introduced the Series 2280S Precision Measurement, Low Noise, Programmable DC Power Supplies. Unlike conventional powe...
Cadence Design Systems, Inc., a leader in global electronic design innovation, today introduced Cadence® Voltus™-Fi Custom Power Integrity Solution, a transistor-level electromigration and IR-drop (EMIR) solution that delivers foundry-certified SPICE-level accuracy in power signoff to create the fastest path to design closure.
AgigA Tech Inc., a subsidiary of Cypress Semiconductor Corp. and a leading provider of high-speed, high-density, battery-free non-volatile memory solutions, will demonstrate its Nonvolatile DIMM (NVDIMM) technology in server and storage platforms at the Flash Memory Summit August 4-7, 2014.
eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced that it has shipped over ten million chips to date. The majority of the shipments are utilized in some of the fastest growing and dynamic markets.
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