Aiming to cut the cost of manufacturing flexible and large-size OLEDs, Kateeva today debuted YIELDjet™—an inkjet printing manufacturing equipment solution to produce such OLEDs in high volume. It’s the world’s first inkjet printer engineered from the ground up for OLED mass production. When compared to existing manufacturing technologies, YIELDjet will enable dramatic yield improvements, which, in turn, will drive production costs lower.
Though some people already seem inseparable from their smartphones, even more convenient, wearable, solar-powered electronics could be on the way soon, woven into clothing fibers or incorporated into watchbands. This novel battery development, which could usher in a new era of "wearable electronics," is the topic of a paper in the ACS journal Nano Letters.
As the consumer electronics industry works to develop smaller, lighter devices that perform better and have ever-increasing capabilities, engineers need materials that enable – and even enhance – their next-generation designs. Materion Brush Performance Alloys, a Materion Corporation business, is focused on meeting emerging electronics needs, and recently developed three new products for its BrushForm®158 product line (BF TM12, BF TM04 and BF TM06) specifically for next-generation electronics devices.
Silego Technology the world leader in quartz replacement 32.768 kHz ICs introduced the third generation GreenCLK3TM 32.768 kHz oscillator family. At only 1x1.6 mm the oscillators are the world’s smallest in standard plastic packaging. The product family is also available in die form with a total area of less than <0.6 sq mm or fully 50% smaller than competitive devices.
Cadence Design Systems, Inc., a leader in global electronic design automation, today announced that Faraday Technology Corp., based in Hsinchu, Taiwan, deployed a full Cadence® tool flow to create its largest System-on-Chip (SoC), a 300-million-gate design for a 4G base station. By using Cadence Encounter® digital design tools in Faraday’s hierarchical flow, the design team completed this complex SoC, from data-in to tapeout, in just seven months.
NXP Semiconductors N.V., the global leader in secure banking and eGovernment deployments, today launched its new SmartMX2-P40 platform of chip card microcontrollers for large-scale projects in the rapidly growing banking and electronic-Government (eGov) markets.
Universal Electronics Inc. (UEI) today announced that its wholly owned subsidiary, UEI Brasil Controles Remotos Ltda. has met an impressive milestone in manufacturing having delivered its 10 millionth remote control.
Still celebrating the good success of their ongoing Indiegogo crowdfunding campaign for their iQi Mobile Wireless Charger For iPhone, Fonesalesman will has launch its Note 3 Wireless Charging System as well.
Further easing the development of processing-intensive applications, Texas Instruments (TI) is unveiling a new system-on-chip (SoC), the 66AK2H14, and evaluation module (EVM) for its KeyStoneTM-based 66AK2Hx family of SoCs. With the new 66AK2H14 device, developers designing high-performance compute systems now have access to a 10Gbps Ethernet switch-on-chip.
Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced that its AWG70000 Arbitrary Waveform Generator Series and its PA4000 Power Analyzer won EDN China's 2013 Innovation Award in the "Communication Test" and "General Test" categories of Test and Measurement.
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