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Flash Memory Summit: Toshiba to Highlight Latest NAND Flash and Storage Products

Toshiba Corporation today announced that it will showcase its latest NAND flash and storage products at Flash Memory Summit, the world’s largest flash memory conference, which will be held from August 5 to 7 at the Santa Clara Convention Center in Santa Clara, California, USA.

The exhibition part of Flash Memory Summit will be held in the latter two days, August 6 and 7, and Toshiba will be exhibiting at booth #504.

Main Exhibitions

1. Enterprise SSD:
Enterprise Read Intensive SSD PX03SN/HK3R Series
High Read IOPS Server Demonstration of the PX03SN Series

2. Client SSD:
High-End Client SSD HG6 Series
TLC[1] NAND Embedded Client SSD SG4 Series (Reference Exhibit)

3. Mobile Memory:
Embedded Storage Memory Solution: UFS[2], e-MMCTM
Media Card: SD Memory Card, USB Flash Memory
Wireless LAN SDHC Memory Card: FlashAirTM

4. Enterprise & Industrial Memory:
SLC[3] NAND, BENANDTM [4], 15nm Process NAND Wafer

Notes
[1] TLC: Triple Level Cell (Storage type of NAND flash storing data of 3-bit-per-cell)
[2] UFS: Universal Flash Storage
[3] SLC: Single Level Cell
[4] BENANDTM: Built-in ECC NAND
* e-MMC is a trademark of JEDEC/MMCA.
* FlashAirTM and BENANDTM are trademarks of Toshiba Corporation.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Source: http://www.toshiba.co.jp/

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