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Plasma Treatment May Help Overcome Challenges of Conformal Coating

Nordson MARCH, a Nordson Company, a global leader in plasma processing technology, will present the paper “Overcoming the Challenges Presented with Automated Selective Conformal Coating of Advanced Electronic Assemblies by Employing Plasma Treatment Technology,” by David Foote, global applications manager, Nordson MARCH, at SMTA International 2013, Fort Worth, TX, Tuesday, October 15, from 4:00–5:30 PM, in Technical Session MFX3, Room 202D.

From Nordson MARCH 11 Oct 2013

Eaton’s Worksop Manufacturing Plant Wins Energy & Environment Best Factory Award

Power management company Eaton is delighted to announce that its manufacturing plant in Worksop, United Kingdom, has won the Energy & Environment category at this year’s Best Factory Awards. The awards were presented at a ceremony held in London on 27th September, and additionally saw Eaton being Highly Commended for its plant in the highly regarded Best Electronics & Electrical Plant category.

From Eaton Corporation 11 Oct 2013

New Low-Voiding Flux Coating for Solder Preforms from Indium

Indium Corporation introduces a new,high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0)materialis especially suited for assembly processesin which the components don’t allow for proper outgassing of volatized flux.

11 Oct 2013

New Tin-Silver Plating Chemistry for Lead-Free Bump Plating Launched by Dow

Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).

From Dow Chemicals 11 Oct 2013

IMPACT Conference: Indium Technology Expert to Discuss Newly-Developed Epoxy Flux

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.

11 Oct 2013

New High-Performance Thermally Conductive Adhesives for Automotive Electronics Applications from Dow Corning

Dow Corning®, a global leader in silicones, silicon-based technology and innovation, announced today at Bondexpo two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies.

From Dow Corning 10 Oct 2013

RIT Package-on-Package Technology Researcher Awarded Surface Mount Technology Association Grant

Printed circuit boards for consumer electronics are like a city skyline. With limited real estate to build across a neighborhood block, developers build up, story-upon-story. Memory chips and logic devices are being stacked in a similar fashion on circuit boards the size of credit cards as a way to increase power and performance across the board’s “real estate.”

10 Oct 2013

New Market Research Report on Functional Materials for Future Electronics

Reportlinker.com announces that a new market research report is available in its catalogue: Functional Materials for Future Electronics: Metals, Inorganic & Organic Compounds, Graphene, CNT

10 Oct 2013

Master Bond Release New Catalog for Adhesives, Sealants and Coatings for Electronics

Master Bond have released a new, easy to read, 32 page catalog offering performance and processing data on their extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds.

From Master Bond Inc. 8 Oct 2013

Point Grey USB3 Vision Cameras Now Compatible with ActiveUSB Drivers and SDK

Point Grey, a world-leading designer and manufacturer of innovative, high-performance digital cameras, today announced out-of-the-box interoperability between Point Grey's Flea®3 USB3 Vision cameras and ActiveUSB...

From Teledyne FLIR LLC 8 Oct 2013

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