Nanomaterials and Nanotechnology News

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CCD and CMOS Technology Intergrated By Imec To Improve Performance Of CMOS Imagers

Imec, the Belgian nanoelectronics research center, will present at this week’s ‘CMOS Image Sensors for High Performance Applications’ workshop in Toulouse (France) a prototype of a high-performance, tim...

From IMEC 25 Nov 2013

Holst Centre, imec and ZOL Partner to Develop Wearable Sensor Technologies for Healthcare Applications

Imec, Holst Centre and the East-Limburg Hospital (Ziekenhuis Oost-Limburg, ZOL) have announced a strategic partnership to accelerate the development of wearable sensor technologies for remote healthcare and personal health applications.

From IMEC 22 Nov 2013

Faraday Deploys Full Cadence Tool Flow to Create its Largest SoC for 4G Base Station

Cadence Design Systems, Inc., a leader in global electronic design automation, today announced that Faraday Technology Corp., based in Hsinchu, Taiwan, deployed a full Cadence® tool flow to create its largest System-on-Chip (SoC), a 300-million-gate design for a 4G base station. By using Cadence Encounter® digital design tools in Faraday’s hierarchical flow, the design team completed this complex SoC, from data-in to tapeout, in just seven months.

20 Nov 2013

Picodeon ColdAb Ultra-Short Pulsed Laser Deposition Systems Enable Thinner Platinum and Gold Films

Finnish coating technology specialist Picodeon Ltd has developed its ColdAb® ultra-short pulsed laser deposition technology (US PLD) for use in the application of gold and platinum thin films, enabling thinner films and thereby reducing precious metal costs.

13 Nov 2013

Three-Dimensional Form of Carbon Becomes Metallic Under Ambient Temperature and Pressure

A theoretical, three-dimensional (3D) form of carbon that is metallic under ambient temperature and pressure has been discovered by an international research team.

8 Nov 2013

World’s First III-V FinFET Devices Monolithically Integrated on 300mm Silicon Wafers by Imec

Imec, a leading nanoelectronics research center, announced today that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers, through a unique silicon fin replacement process.

From IMEC 5 Nov 2013

New Report on Global Advanced Functional Material for Low Carbons Market

Research and Markets has announced the addition of the "Advanced Functional Material Market For Low Carbon Applications by Categories, Applications & Geography - Global Trends & Forecasts To 2018" report to their offering.

From Research and Markets 18 Oct 2013

Advanced Patterning Center Launched by ASML and imec

Today, ASML and imec announced the next major step in their extensive collaboration, with the launch of the Advanced Patterning Center. Together they plan to tackle upcoming scaling challenges due to the chip industry’s move towards single digit nanometer dimensions. The Center will be located at the imec campus in Leuven and is expected to grow to close to 100 engineers over the next couple of years.

From IMEC 8 Oct 2013

Leading Power Device Manufacturer Places Multiple Orders for Oerlikon’s CLUSTERLINE 300

Oerlikon Advanced Technologies, a leading supplier of PVD deposition equipment, has today set a new standard with the CLUSTERLINE® 300 as the first 300mm system worldwide running thin wafer backside metallization (BSM) for power devices in production.

4 Oct 2013

Imec and Meco Showcase Large Area i-PERC-Type Silicon Solar Cells with Ni/Cu Plating for Front Contacts

At this week’s European Photovoltaic Solar Energy Conference and Exhibition (EUPVSEC in Paris), imec, a nanoelectronics research center based in Belgium, and Meco, a supplier of plating equipment for semiconductor and solar industry, present large area (156x156mm2) i-PERC-type silicon solar cells with industry-applicable Nickel/Copper (Ni/Cu) plating for the front contacts.

From IMEC 30 Sep 2013

Editorial Highlights

Nanomaterials and Nanotechnology News

CCD and CMOS Technology Intergrated By Imec To Improve Performance Of CMOS Imagers

Holst Centre, imec and ZOL Partner to Develop Wearable Sensor Technologies for Healthcare Applications

Faraday Deploys Full Cadence Tool Flow to Create its Largest SoC for 4G Base Station

Picodeon ColdAb Ultra-Short Pulsed Laser Deposition Systems Enable Thinner Platinum and Gold Films

Three-Dimensional Form of Carbon Becomes Metallic Under Ambient Temperature and Pressure

World’s First III-V FinFET Devices Monolithically Integrated on 300mm Silicon Wafers by Imec

New Report on Global Advanced Functional Material for Low Carbons Market

Advanced Patterning Center Launched by ASML and imec

Leading Power Device Manufacturer Places Multiple Orders for Oerlikon’s CLUSTERLINE 300

Imec and Meco Showcase Large Area i-PERC-Type Silicon Solar Cells with Ni/Cu Plating for Front Contacts

Driving the Next Chapter of Thin-Film Deposition

Recycling Plastic Waste Through Extrusion: A Closer Look at Mechanical Processing of Marine Plastics

Ultra Pure Water Management in Semiconductor Manufacturing

The stRAMos Photothermal Stimulated Raman System

FUSION PTR-TOF 20 for Enhanced VOC Analysis

How TIDAS Automates Hegman Gauge Readings for Greater Accuracy and Repeatability

Editorial Highlights

Material Trends in Space: What Rockets are Made of (and More)

How Long Until Hydrogen Fuel is a Reality?

Recycling Lithium Batteries: Closing the Loop on Energy Storage

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