Applied Materials, Inc., the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass, today announced its new Applied Vantage® Astra™ millisecond anneal system, an important breakthrough in transistor fabrication that enables faster, lower power consumption devices.
Quite a few people wondered if it would ever function. Yet right on time for the first Advent Sunday it is obvious to all: But still it moves! Siemens – together with multimedia artist Michael Pendry – has lighted up the world’s biggest revolving Christmas star. The lighting installation can be seen throughout December at the northern gateway to Munich – beginning at dusk every evening. “The Siemens Superstar is a pioneering technological project and an important symbol for the Global Climate Conference in Copenhagen.
Computer chips that transmit data with light instead of electricity consume much less power than conventional chips, but so far, they've remained laboratory curiosities. Professors Vladimir Stojanovic and Rajeev Ram ...
Novellus Systems (NASDAQ:NVLS) has developed a suite of ashable hardmask (AHM) films that have up to 25 percent greater etch selectivity compared to similar amorphous carbon films in use by the industry today. This highly selective and transparent (HST) AHM family of films has demonstrated die yield improvements as much as 7 percent when coupled with Novellus' patented integrated edge bevel removal (EBR) technology.
Toshiba Corporation today announced that it has developed a high resolution photoresist (photo-sensitive film) essential for future application of EUV (extreme ultraviolet) lithography in semiconductor fabrication, and proved its viability with the world's first 20nm-scale generation process technology.
New nanoscale materials and devices are required to replace the silicon transistor that's at the heart of today's semiconductors, but to build these new devices, researchers will have to be able to measure the thickness - if that's the right word - of layers consisting of only a few atoms, according to a UT Dallas researcher.
TDK-EPC, a group company of TDK Corporation, presents a new sample kit with EPCOS SMD CU varistors. The electrical parameters of these CTVS (ceramic transient voltage suppression) components correspond to the leaded disk varistors of the proven EPCOS series SIOV-S05 in case size 3225 and SIOV-S07 in case size 4032.
OSRAM’s highly efficient LED modules are used in fog lights on BMW motorcycles. The modules are very resistant to shocks and vibrations with a lifespan that usually exceeds that of the motorcycle itself.
A radiation-resistant version of NRAM(TM) carbon-nanotube-based memory, developed jointly by Lockheed Martin (NYSE: LMT) and Nantero, was tested on a recent Space Shuttle mission. The NRAM(TM) was incorporated by NASA in...
Scientists at the Department of Energy's Lawrence Berkeley National Laboratory, in cooperation with the International SEMATECH Manufacturing Initiative (ISMI), are releasing for beta testing a computer-based tool to help the world's semiconductor manufacturing facilities ("fabs") evaluate and improve their energy efficiency.
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