PolyOne Corporation, a leading global provider of specialized polymer materials, services and solutions, has reorganized its Polymer Coating Systems (PCS) into two business units.
The Wilflex inks and specialty colora...
Over the last four decades, computer chips have found their way into virtually every electronic device in the world. During that time they have become smaller, cheaper and more powerful, but, for a team of European resea...
OSRAM Opto Semiconductors has carried out pioneering work in the development of thin-film LEDs – supported by Fraunhofer researchers from Jena. The team of researchers has won the German Future Prize 2007 for their development of LED-based illumination modules.
Pipe joints require a high level of guaranteed performance and as a consequence the industry uses advanced technology in both fitting manufacture and joint sealing. AMI has reviewed the state of the European pipe industry - around 3.5 million tonnes of plastics are used per annum.
OM Group, Inc. today announced that it has completed its previously announced acquisition of the electronics businesses from Rockwood Holdings, Inc. for approximately $315 million in cash, plus customary post closing adj...
This year’s Nobel Prize for Physics was awarded to the discoverers of the giant magneto resistance effect. Infineon has begun using this effect to measure steering angle in automobiles and is the world’s firs...
The fan in your computer is there to keep the microprocessor chip from heating to the point where its component materials start to expand, inducing cracks that interrupt the flow of electricity - and not incidentally, ru...
Due to their stable design, Fizeau interferometers are used to determine the topography of surfaces such as, e.g., plane surfaces. PTB has now developed a method which makes it possible to analyse surfaces with different...
Reliance Steel and Aluminum Co. announced today that its subsidiary, Valex Corp. has opened a facility in the People’s Republic of China. Valex China Co. Ltd. is 100% owned by the Hong Kong joint venture company Va...
Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a “wafer bonding” technique developed by a European research consortium. Wit...
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