Jun 10 2008
SEMICON West 2008, San Francisco, July 15-17, will see the debut of a new release of PANalytical’s proven software for thickness and composition of thin films by X-ray fluorescence (XRF). The new SuperQ 4.0 Thin Film package features updated Fundamental Parameter Software (FP Multi) for the analysis of complex multi-layer stacks, with best in class performance on up to 16 layers. It is also now possible to measure and track wafers throughout various deposition steps, until a film stack is completed. For each measurement, the results of the previous steps are taken into account, delivering rapid and automatic verification of layer and stack thickness and composition across the complete wafer.
The software makes it easy for even relatively inexperienced staff to run day-to-day analysis. At the same time, it delivers powerful data on thickness, composition, stoichiometry, dopant levels and uniformity for a wide range of layer types and stacks. Stop by booth 106 (South Hall) for a demonstration.
PANalytical’s X’Pert PRO MRD and X’Pert PRO MRD XL X-ray diffraction (XRD) systems are valuable tools for R&D and process control for III-V, and other, types of solar cells. Superior resolution and advanced detectors characterize the systems and unique Prefix modules allow reconfiguration without the need for extensive alignment. X’Pert PRO systems are the ideal choice for studying a wide range of parameters including film thickness, roughness and density, texture in films, and thin film stress. Depth resolved phase analysis of layer stacks, precise measurement of lattice parameters and assessment of epitaxial layer strain, composition and relaxation are also common applications. Crystallite size and porosity can be analyzed too. Get more details at booth 106 (South Hall).
For visitors to the show looking for a cost-effective solution for on-product X-ray analysis of thin films, PANalytical will also highlight the company’s Semyos high-end, X-ray fluorescence (XRF) metrology tool. As thin film technology advances, semiconductor and hard disk manufacturers increasingly rely on XRF analysis. PANalytical's Semyos energy-dispersive XRF wafer analyzer can play a vital role. The system combines the company’s extensive know-how on thin film XRF analysis and best in class sensitivity with a less than 23 µm FWHM (Full Width, Half Max) measuring spot, to enable direct measurement on production wafers of up to 300 mm.
Semyos perfectly meets the needs of the semiconductor and data storage industries. Applications include: characterization of films containing elements from Al onwards in metrology areas in the scribeline, accept/reject assessment of complex stacks, control of the metallization processes, analysis of barrier films, and characterization of read/write heads and magnetic media thin films.
A versatile front end module enables Semyos to load 100-300 mm wafers from a user-selected combination of SMIF, FOUP and open cassette load ports. Talk to a PANalytical specialist at booth 106 (South Hall) about your on-product measurement needs.
PANalytical's range of tools is unique in covering research and development, pilot production and volume manufacture. This significantly simplifies the hand-over from R&D to pilot (and even volume production lines) in the silicon, data storage and compound semiconductor industries.