Rudolph Technologies, Inc. (“Rudolph” or the “Company”), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today that it has entered the back-end advanced packaging lithography market with the new JetStep™ Lithography System, a disruptive innovation featuring a 2X reduction stepper.
Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®.
Cohu, Inc. today announced that it has agreed to acquire Ismeca Semiconductor Holding SA (Ismeca) from Schweiter Technologies AG for $54.5 million, plus acquired cash, to be funded out of Cohu’s existing cash reserves.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and CEA-Leti, France's premier research and technology institute, announced that a team of ST and CEA-Leti researchers had received the 2012 Général Ferrié Award.
Reportlinker.com announces that a new market research report is available in its catalogue: Global Semiconductor Market Forecast to 2015
Leading semiconductor test equipment supplier Advantest Corporation has introduced its new T2000 8GDM to address the test requirements of system-on-chip (SoC) devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate (DDR) connections.
Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received over $2 million in follow-on production orders for its burn-in and test systems from multiple leading manufacturers of advanced logic integrated circuits (ICs) for automotive applications.
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today introduced an 80nm SDDI (Small-panel Display Driver IC) foundry process with the most competitive SDDI SRAM bitcell in the foundry industry. The low power, advanced SRAM solution applies aggressive foundry design rules to shrink the bitcell size down to 0.714 um square to enable HD720/WXGA smartphone resolutions, far less than the typical 0.81um square size used in current 80nm SDDI processes. The process is ready for mass production, with several Tier-1 customers engaged for HD720/WXGA smartphone resolution applications.
Teledyne DALSA, a Teledyne Technologies company and a global leader in high performance digital imaging and semiconductors, is proud to have been honored as Business of the Year by the Netherlands-Canadian Chamber of Commerce (NCCC). The award was presented by His Excellency Mr. James Lambert, Canada’s Ambassador to the Netherlands, at a ceremony held November 14 in The Hague.
Plastic electronics, in which an organic material replaces silicon, hold promise for low-cost, flexible electronics. But understanding and controlling these materials' microstructures is an ongoing challenge.
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