Dow Corning Corporation’s Electronics group today announced the worldwide availability of its DOW CORNING® TC-2030 A&B Thermally Conductive Adhesive for use in automotive electronics, LED assembly and in the computer market. TC-2030 offers outstanding thermal conductivity and excellent elastomeric properties after aging, providing long-term reliability.
Good adhesion to various substrates, such as anodized or cast aluminum, tin-plated copper and printed circuit boards, make this material well suited for use across a wide variety of electronics markets.
TC-2030’s thermal conductivity of 2.7 W/mK is higher than traditional thermally conductive adhesives. With a viscosity of 190 Pa·s, it also offers good dispensing characteristics and can be easily applied by a dispenser after the two-part formulation is mixed.
“The introduction of TC-2030 expands Dow Corning’s line of thermally conductive adhesive products to meet a wider range of customer needs,” said Rogier Reinders, Dow Corning’s global automotive marketing leader. “Dow Corning has been using field-proven fillers to achieve new levels of loading, rheology and bondline control with a resulting step change increase in thermal performance and stability after aging. The electronics market has shown a need for improved heat dissipation in printed circuit board applications with high power components.. Dow Corning’s high thermal conductivity TC-2030 provides manufacturers with a viable option to address this need.”