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Nihon Superior to Introduce TempSave During APEX 2021

Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce that it will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloy along with SN100CV P608 and LF-C2 P608 solder pastes. 

Nihon Superior will introduce its TempSave™ series of low temperature soldering materials to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139 °C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag. 

High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys.  The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190 °C.  Additionally, TempSave B37 is available in solid wire form.

The NozzleSave S solder alloy extends the life of selective soldering nozzles by 2X. As solder nozzles wear, the solder wave form from the nozzle and wave height are affected. By extending the life of the solder nozzle, the user experiences cost savings and process stability for improvement in soldering quality.

SN100CV® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305 while maintaining a high level of resistance to impact loading. LF-C2 is a high reliability lead-free alloy as it uses both dispersion and solid solution strengthening. With a liquidus temperature of 213 °C it can be reflowed at a lower temperature than SAC305.

The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free.  SN100CV P608 and LF-C2 both deliver excellent performance over a wide range of component types and process parameters.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english.

Source: http://www.nihonsuperior.co.jp/english

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