The Multipol 8 is a versatile lapping and polishing machine suited to the preparation of the most demanding of samples, such as delayering electronic circuitry from the front side of dice to submicron accuracy.
The device can use all polishing techniques including abrasive, diamond, slurry, CMP and etch polishing. Further it can polish flatter than most existing systems.
The unit also features quick release fixtures to allow rapid removal of samples so they can quickly be checked under the microscope. The unit also offers improved control and precision in cross-sectioning, electron microscopy and back side sample preparation.
Cleaning of the apparatus has also been made user friendly by making all components easily detachable.