High-Performance Materials for Electronic Applications: RUBALIT Alumina and ALUNIT Aluminum Nitride

Hybrid microelectronic circuits form the basis of a wide range of electronic applications. The growing integration density of electronic circuits, which is a result of the market's demand for increasingly miniaturized products, calls for ever new solutions in the field of substrates. Ceramic components in electronic devices must resist high mechanical, thermal, and electrical loads while simultaneously performing with the utmost reliability. Our advanced high-performance materials are designed to meet these needs.

RUBALIT® Alumina - Superior Substrate Materials from CeramTec

A key prerequisite for CeramTec's successful partnership with the electronics industry is the ability to deliver the right materials. The family of RUBALIT® materials developed by our company has become a byword of quality among the world's most renowned manufacturers of hybrid circuits and has established itself as the standard choice in many electronic circuit applications.

High strength and thermal conductivity are the characterizing features of these substrate materials. Providing an outstanding surface quality on both faces, RUBALIT® 708S (96% Al203) gives outstanding results with commercially available thick-film pastes and metallization systems. In addition, this material is suitable for both fine line and sometimes thin-film applications. For optimum results in thin-film technology, RUBALIT® 710 (99.6% Al203) is the material of choice.

High-Performance Materials for Electronic Applications: ALUNIT® Aluminum Nitride Ceramics

Cool Solutions for Power Electronics

Progressive advances in power electronics have called for the use of sophisticated cooling systems to dissipate the intense heat build-up. For example, special heat exchangers based on CeramTec's ALUNIT® aluminium nitride material allow the use of water as a cooling fluid as a substitute for environmentally hazardous oil cooling systems. Used as mountings for electronic power components, these heat exchangers dissipate heat at its point of origin.

ALUNIT Aluminum Nitride For Maximum Performance

With its extremely high thermal conductivity of 180 W/mK and outstanding electrical insulation properties, CeramTec's ALUNIT® aluminium nitride is the high-end supplement to our RUBALIT® alumina ceramics range. The thermal expansion coefficient of this material is comparable to silicon. Its electrical and mechanical characteristics are similar to alumina. Like RUBALIT® alumina materials, ALUNIT® aluminium nitride is non-toxic and environmentally compatible, presenting no disposal problems.

These new properties open entirely new fields of application in advanced circuit engineering. With its enhanced heat dissipation, ALUNIT® aluminium nitride enables the production of compact high-performance solutions. It is the preferred substrate for power hybrid and VLSI-type MCM circuits. Our product range includes substrates and dry-pressed components made to customer's specifications ready for further processing, and also products already subjected to finishing operations such as lasering, grinding, and polishing.

This information has been sourced, reviewed and adapted from materials provided by CeramTec.

For more information on this source, please visit CeramTec.

 

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