The Source 1600 is our most flexible Variable Frequency Microwave (VFM) system for process development and OEM system development, allowing remote cavity placement for in-situ and inline processing.
Variable Frequency Microwave (VFM)
To overcome some of the problems inherent with conventional microwave, Lambda offers a range of VFM products that ensure uniformity over large areas and compatibility with metals and electronic circuits. Lambda customer support staff includes microwave design and service engineers as well as materials scientists ready to assist in customer specific applications.
Lambda’s patented VFM technology offers precise control and uniform distribution of microwave energy for a broad range of thermal applications. Unlike conventional industrial microwave ovens that use a fixed frequency magnetron, VFM products use a broadband microwave amplifier to enable optimum frequency selection and the ability to sweep around a center frequency to ensure good mode density and energy uniformity. Sweep rate control also ensures that VFM technology is compatible with metallic components or fixtures, without arcing, and with electronic circuitry or semiconductors without causing damage.
VFM technology is in production worldwide for the curing of polymeric adhesives and films used in advanced semiconductor and electronic packaging applications.
Features of MicroCure 1600
Features of MicroCure 1600 Variable Frequency Microwave Curing Oven by Lambda Technologies include:
- Advanced VFM source provides uniform, component safe heating
- Remote and self-hosted modes of control
- Agile control architecture for precise open or closed loop control of energy transfer
- Flexible interface design for embedding into process tools or manufacturing cells
Benefits of MicroCure 1600
Benefits of MicroCure 1600 Variable Frequency Microwave Curing Oven include:
- Faster, controlled cure of adhesives, epoxies, encapsulants and other chemical systems
- Rapid cure of polyimides at reduced temperatures
- Unique material assemblies and bonding geometries are possible due to selective and sub-surface energy absorption characteristics of VFM
- Less time at temperature as well as selective heating work to reduce stress and provide for a wider range of material choices
- Reduced heating time also saves on an assemblies’ valuable thermal budget allotment
- Less Work In Process (WIP) reduces loss incurred in cases when unscheduled production line stoppages occur
- VFM requires less energy and floor space
The state of the art VFM technology can be integrated with conventional heating techniques when balance between the volumetric heating characteristics of VFM and the well known surface heating abilities of convection heating are required.
This information has been sourced, reviewed and adapted from materials provided by Lambda Technologies.
For more information on this source, please visit Lambda Technologies.