Imec has developed a Manganese (Mn)-based self-formed barrier (SFB) process that significantly improves Resistance Capacitance (RC) performance, via resistance and reliability in advanced interconnects. It provides excellent adhesion, film conformality, intrinsic barrier property and reduced line resistance. This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.
3M Abrasive Systems rocked the grinding world last year with the introduction of 3M™ Cubitron™ II Bonded Abrasive Grinding and Cut-Off Wheels. Now, those same benefits to the operator – faster cutting with less pressure, and longer lasting abrasives – are available in 3M™ Cubitron™ II Flap Discs.
In plastics research, there are various ways of developing innovative and potentially successful new materials. Additives help to give familiar substances new properties, while mixing polymers can lead to some interesting blends. Sometimes progress comes from using processing techniques that were previously reserved for other materials: when it came to the latest addition to the BASF foam plastics family, the company's technological expertise in particle foams was combined with its experience with thermoplastic polyurethanes.
After building a global leadership position developing UV LED curing solutions, Phoseon Technology will display its wide array of the most advanced UV LED curing systems at the Shanghai International Ad & Sign Expo. The Phoseon Technology exhibit (booth number W1-594) will highlight both air-cooled and water-cooled UV LED systems designed for curing a wide array of UV printing applications.
Alcoa announced today that it intends to permanently close its Fusina (Venice, Italy) primary aluminum smelter, which has been curtailed since June 2010. The planned closure will reduce Alcoa’s global smelting capacity of 4.2 million metric tons per year by 44,000 metric tons.
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Schrödinger Inc., a technology leader in atomic-scale modeling and physics-based chemical simulations, and Dr. Mark E. Thompson, Professor of Chemistry at the University of Southern California, announced today their joint research collaboration to advance the development and design of organic semiconductor materials through use of atomic-scale simulations.
3D Systems and Planetary Resources, Inc. announced today that 3D Systems has joined Planetary Resources' core group of investors and will be a collaborative partner in assisting Planetary Resources to develop and manufacture components of its ARKYD Series of spacecraft using its advanced 3D printing and digital manufacturing solutions.
Savvy consumers are being driven to replace current household light bulbs with light-emitting diodes (LED) to reduce energy consumption and costs. This shift away from traditional lighting has caused the LED market to double between 2006 and 2011 with growth projected to continue.
Tucked away on a small Coventry industrial estate is Exactaform,a world leader in the design and manufacture of polycrystalline diamond (PCD) tooling for global aerospace and automotive markets. Design ingenuity combined with investment in staff and the best available machining and test equipment has built and maintained a reputation for delivering the highest quality tooling, quickly and reliably. A recent addition to the R&D capability is a cutting force dynamometer based on a Kistler Instruments piezoelectric multicomponent force link set and amplifier.
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