Proving that a little chip can go a long way, Robert Dennard will receive the $100,000 Lemelson-MIT Lifetime Achievement Award for having come up with a way to arrange transistors and capacitors onto a single silicon chi...
Users of the National High Magnetic Field Laboratory soon will have a new state-of-the-art magnet system for their research in physics and materials science. Engineers at the facility, led by project leader Mark Bird, re...
The potential applications for flexible plastic electronics are enormous -- from electronic books to radio frequency identification (RFID) tags to electronics for cell phones, personal digital assistants (PDAs) and lapto...
University of California scientists at Los Alamos National Laboratory working with a researcher from Chonnam National University in South Korea have found that magnetic fluctuations appear to be responsible for supercond...
As gasoline prices climb ever higher and the U.S. Senate backs oil drilling in Alaska's Arctic National Wildlife Refuge, the possibility of a hydrogen economy -- where drivers tank up on clean-burning hydrogen fuel -...
A new alloy developed and patented by researchers at Lehigh University, Sandia National Laboratory and Idaho National Laboratory could help the U.S. dispose more safely of 50,000 tons of spent nuclear energy fuel that ar...
DuPont Packaging & Industrial Polymers (P&IP) recently hosted the opening ceremony for its DuPont™ Bynel® and DuPont™ Fusabond® adhesive resins production facility in Shenzhen, China. This is ...
A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic polymer has a low diele...
Materials scientists and engineers at Northwestern University are developing a new "high-security" steel that would be resistant to bomb blasts such as the one that struck -- and nearly sank -- the USS Cole in ...
Electrically conductive adhesive (ECA) materials offer the electronics industry an alternative to the tin-lead solder now used for connecting display driver chips, memory chips and other devices to circuit boards. But be...
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