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LEHVOSS’ New Generation Thermoplastic Shielding Compounds Demonstrate Outstanding Performance Against Electromagnetic Waves

LEHVOSS North America, a subsidiary of Lehmann&Voss&Co, announces the introduction of LUVOCOM® ES, a new generation of thermoplastic shielding compounds with outstanding performance against electromagnetic waves and at smaller wall thicknesses. These new compounds are engineered for the housings of electric and electronic devices such as computers, radios, phones, and laboratory equipment.

5 Jun 2015

Leti Demonstrates New High-Brightness Micro-LED Array Fabrication Technology for Head-Mounted Displays

CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

3 Jun 2015

Researchers at Columbia Engineering Create the First Single-Molecule Diode

A new technique has been developed by a research team from Columbia Engineering in order to create the first ever single-molecule diode.

26 May 2015

Novel Electronic Devices Self-Destruct When Triggered By Heat

Researchers at the University of Illinois (U. of I) have developed electronic devices that self-destruct when heated. This study was led by Scott R. White, an aerospace engineering professor at the U. of I.

22 May 2015

Picosun Provides ALD Solutions for IC, MEMS and LED Manufacturing Industries

Picosun Oy, the leading provider of high quality Atomic Layer Deposition (ALD) technology for global industries, reports winning important production markets in MEMS, LED, and other III-V compound semiconductor device ma...

From Picosun Oy 22 May 2015

EAG Extends Leadership in Electronics Failure Analysis Services with Millions in New Tool Investments

Evans Analytical Group (EAG), the world's leading, fully integrated, independent laboratory network providing high value expert analytical and testing services to a wide range of industries and end users, today annou...

From EAG Laboratories 20 May 2015

Liquid Metal Voltage-Controlled Antenna Developed at North Carolina State University

Researchers at the North Carolina State University (NCSU) have created a reconfigurable liquid metal antenna that can be controlled only by voltage. This tunable liquid metal antenna could play a major role in development of future mobile devices and the Internet of Things.

20 May 2015

Researchers Develop Laser-Written Microsupercapacitor Using Boron-Infused Graphene

Researchers from the Rice University have upgraded a microsupercapacitor with a blend of boron and laser-induced graphene, and this may soon find applications in the personal as well as wearable electronics market.

20 May 2015

$PCIM Europe 2015: H.C. Starck to Highlight Refractory Material Products for Power Semiconductor and Thermal Management$

PCIM Europe 2015: H.C. Starck to Highlight Refractory Material Products for Power Semiconductor and Thermal Management

H.C. Starck leads the technology metals industry with its engineered products fabricated from refractory materials for the power semiconductor and thermal management industries.H.C. Starck’s custom-engineered thermal management materials support the electronicsindustry’s migration to increased miniaturization of electronic components that require rapid cooling to be effective.

From HC Starck Tungsten GmbH 18 May 2015

Researchers Fabricate High-Performance 3D Microbatteries by Combining 2D Photolithography and 3D Holographic Lithography

A high-performance 3D microbattery has been fabricated by a research team at the University of Illinois at Urbana-Champaign using a unique combination of 2D photolithography and 3D holographic lithography. This breakthrough device is ideally suited for on-chip integration with microelectronic devices on a large scale.

12 May 2015

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