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Oxford Instruments PlasmaPro® Systems Ordered by Chinese HB-LED Manufacturer

High tech Chinese manufacturer, Enraytek Optoelectronics Co has recently ordered several leading edge Oxford Instruments PlasmaPro 800 PECVD systems for the manufacture of their High Brightness LEDs.

From Oxford Instruments Semiconductor 14 Jul 2015

Nordson ASYMTEK to Display New Programmable Tilt + Rotate 5-Axis Fluid Dispenser at SEMICON West 2015

Nordson ASYMTEK, a Nordson company, a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes.

From Nordson ASYMTEK 10 Jul 2015

Black Phosphorus Could Emerge as Strong Contender to Silicon

Researchers from McGill University and Université de Montréal have suggested that black phosphorus could emerge as a strong contender to silicon as it allows more transistors to be packed on a chip.

9 Jul 2015

ClassOne Launches Fully-Automated Solstice S4 Mid-Sized Electroplater

Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice® family of ≤200mm wafer electroplaters. The fully-automated, cassette-to-cassette Solstice S4 is available with up to 4 chambers and can deliver up to 75wph throughput. In footprint, capacity and cost, the S4 is positioned between the manual-load, development-oriented Solstice LT, with 1 or 2 chambers, and the fully-automated Solstice S8 electroplater with up to 8 chambers.

7 Jul 2015

SEMICON West 2015: Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications.

From Nordson MARCH 2 Jul 2015

Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Zeta Instruments Inc., announced today that a leading Taiwan based outsourced semiconductor assembly and test (OSAT) ordered its third Zeta-580™ automated metrology system for production monitoring of advanced semiconductor packaging, including 2.5D interconnect and fan-out wafer level packaging (FOWLP).

2 Jul 2015

Ultrafast Electron-Based Imaging Technique Holds Promise for Designing Improved Semiconductors

Researchers at Michigan State University have developed an ultrafast electron-based imaging technique that makes it possible to modify the electronic properties of materials such that easy transmission of an electrical current is made possible.

30 Jun 2015

Argonne and UCLA Develop New Method to Create Magnetic Skyrmion Bubbles at Room Temperature

Researchers from the U.S. Department of Energy’s (DOE) Argonne National Laboratory (Argonne) and the University of California, Los Angeles (UCLA) have developed an innovative, simple method for creation of magnetic skyrmion bubbles at room temperature conditions.

16 Jun 2015

LEHVOSS’ New Generation Thermoplastic Shielding Compounds Demonstrate Outstanding Performance Against Electromagnetic Waves

LEHVOSS North America, a subsidiary of Lehmann&Voss&Co, announces the introduction of LUVOCOM® ES, a new generation of thermoplastic shielding compounds with outstanding performance against electromagnetic waves and at smaller wall thicknesses. These new compounds are engineered for the housings of electric and electronic devices such as computers, radios, phones, and laboratory equipment.

5 Jun 2015

Leti Demonstrates New High-Brightness Micro-LED Array Fabrication Technology for Head-Mounted Displays

CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

3 Jun 2015

Editorial Highlights

Electronics News

Oxford Instruments PlasmaPro® Systems Ordered by Chinese HB-LED Manufacturer

Nordson ASYMTEK to Display New Programmable Tilt + Rotate 5-Axis Fluid Dispenser at SEMICON West 2015

Black Phosphorus Could Emerge as Strong Contender to Silicon

ClassOne Launches Fully-Automated Solstice S4 Mid-Sized Electroplater

SEMICON West 2015: Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Ultrafast Electron-Based Imaging Technique Holds Promise for Designing Improved Semiconductors

Argonne and UCLA Develop New Method to Create Magnetic Skyrmion Bubbles at Room Temperature

LEHVOSS’ New Generation Thermoplastic Shielding Compounds Demonstrate Outstanding Performance Against Electromagnetic Waves

Leti Demonstrates New High-Brightness Micro-LED Array Fabrication Technology for Head-Mounted Displays

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