Research and Markets has announced the addition of the "Global Electronic Packaging Market 2014-2018" report to their offering.
Vishay Intertechnology, Inc. today introduced a new dual n-channel TrenchFET® power MOSFET in the ultra-compact, thermally enhanced PowerPAK® SC-70 package. Designed to save space and increase power efficiency in portable electronics, the Vishay Siliconix SiA936EDJ features the industry's lowest on-resistance for 20 V (12 V VGS and 8 V VGS) devices at 4.5 V and 2.5 V gate drives in the 2 mm by 2 mm footprint area.
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.
Semiconductor Manufacturing International Corporation ("SMIC"), China's largest and most advanced semiconductor foundry, announced today that a full set of Electrostatic Discharge (ESD) protection service, including documents, checklists, PERC Suite, floor plan review, and risk management services, has been offered to IC design customers to enhance the whole chip ESD design and ensure their first silicon success.
RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, today announced it has signed a $9.7 million agreement with the Manufacturing and Industrial Technologies Directorate within the Air Force Research Laboratory (AFRL) to transfer and produce a 0.14 micron Gallium Nitride (GaN) monolithic microwave integrated circuit (MMIC) technology.
Freescale Semiconductor, the global leader in radio frequency (RF) power transistors, today introduced the first 2W integrated power amplifier operating with a 5V supply and delivering more than 40 dB of gain to cover all frequency bands between 1500 MHz and 2700 MHz. The component supports any cellular standard operating at this frequency including GSM, 3G, 4G and LTE.
Power management company Eaton today announced that it will invest in a new manufacturing facility in the Philippines for its electrical business to further expand its operations in the Asia Pacific market. A groundbreaking ceremony was held today, and was attended by representatives from government, local organizations and Eaton leadership.
University of Utah electrical engineers fabricated the smallest plasma transistors that can withstand high temperatures and ionizing radiation found in a nuclear reactor. Such transistors someday might enable smartphones that take and collect medical X-rays on a battlefield, and devices to measure air quality in real time.
EpiGaN nv, a leading provider of III-nitride epitaxial materials, was awarded the title of National Trends Gazelle Ambassador 2014 in the category ‘Starter’ by Trends, a leading financial-economics Belgian magazine.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Yamaha Corporation (Yamaha) utilized components of the Cadence® Low-Power Solution to achieve a 50 percent reduction in leakage power in its newest chip for smartphones.
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