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Microplasma Transistors Withstand High Temperatures and Ionizing Radiation in Nuclear Reactors

University of Utah electrical engineers fabricated the smallest plasma transistors that can withstand high temperatures and ionizing radiation found in a nuclear reactor. Such transistors someday might enable smartphones that take and collect medical X-rays on a battlefield, and devices to measure air quality in real time.

24 Mar 2014

Trends Honors EpiGaN with National Trends Gazelle Ambassador ‘Starter’ 2014 Award

EpiGaN nv, a leading provider of III-nitride epitaxial materials, was awarded the title of National Trends Gazelle Ambassador 2014 in the category ‘Starter’ by Trends, a leading financial-economics Belgian magazine.

21 Mar 2014

Yamaha Utilizes Cadence Components to Reduce Leakage Power in New Smartphone Chip

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Yamaha Corporation (Yamaha) utilized components of the Cadence® Low-Power Solution to achieve a 50 percent reduction in leakage power in its newest chip for smartphones.

20 Mar 2014

New Report on Test and Measurement in the Global Electronics Manufacturing Services Market

Research and Markets has announced the addition of the "Test and Measurement in the Global Electronics Manufacturing Services Market" report to their offering.

From Research and Markets 19 Mar 2014

SEMICON China: Linde LienHwa to Highlight Gases in Electronics Manufacturing

This week Linde LienHwa (LLH) China, a joint venture between The Linde Group and Taiwan MiTac Group, will be exhibiting at SEMICON China 2014 at the Shanghai New International Expo Centre (SNIEC). Exhibiting at the largest microelectronics industry event in China, serving the Semiconductor, Flat Panel Display (FPD), LED, MEMS, and related technology markets, LLH will showcase the Group’s portfolio of gases and services in electronics manufacturing at Hall N1, booth #1443.

19 Mar 2014

Huawei Awards Spansion Green Certification for Environmental Conscientiousness

Spansion Inc., a global leader in embedded systems solutions, has been awarded Huawei Green Certification in recognition of Spansion's ability to ensure product content and manufacturing processes meet or exceed Huawei's stringent green requirements. The certification is given following a strict qualification process and is valid for two years.

18 Mar 2014

Ceradrop Will Exhibit Advances in Inkjet Materials Deposition Systems

CERADROP is happy to present advances made in Materials Deposition Inkjet Systems with integrated post processing for Printed Electronics and Smart 3D Printing, carrying out printing demonstrations in collaboration with ArjoWiggins Creative Papers.

From Ceradrop 18 Mar 2014

Xilinx Offers High Performance DDR4 Memory Solution for All Programmable UltraScale Devices

Xilinx, Inc. today announced availability of the industry's first high performance DDR4 memory solution for All Programmable UltraScale™ devices running at 2400 Mb/s. Based on an ASIC-class architecture, the UltraScale devices support massive I/O and memory bandwidth with dramatic power and latency reduction.

11 Mar 2014

Increasing Demand for Smartphones and Tablets to Drive Global Wafer Level Packaging Inspection Systems Market

Research and Markets has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018" report to their offering.

From Research and Markets 28 Feb 2014

National Instruments Introduces PXIe-4139 System Source Measure Unit for Semiconductor and Electronics Testing

National Instruments today announced the NI PXIe-4139 system source measure unit (SMU), a high-performance addition to the company's SMU portfolio. This SMU can reduce overall cost of test and accelerate time to market for test engineers in a broad range of industries, from semiconductor to automotive and consumer electronics.

27 Feb 2014

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