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Dow Corning Introduces Silicone-Based Materials for New Lighting Technology

Dow Corning which specialises in silicones and silicone based technology will display silicone-based materials at the exhibition titled “Strategies in Light” which is to be held at the Santa Clara Convention Centre during February 7-9, 2012.

From Dow Corning 19 Jan 2012

Ioxus Unveils 3,000-F Ultracapacitor Line

Ioxus, a company specializing in high-performance ultracapacitor technology, has introduced its 3,000-F ultracapacitor called iCAP. It is the first size in a new portfolio of cell products.

19 Jan 2012

IEE Extends its 3D Display Technologies to Retail Applications

US based IEE has introduced its 3D Display technology to retail applications such as kiosks, point of sale displays and pole displays.

18 Jan 2012

Scientists from University of Twente Develop Rare-Earth-Ion-Doped Optical Amplifiers

Researchers at the University of Twente’s MESA+ Institute for Nanotechnology have created an optical amplifier doped with a rare earth ion.

11 Jan 2012

New Material Could Increase the Performance of Electronics

A team of researchers from the University of Dallas are in the process of establishing that a new material could cool electronic devices such as computers and cell phones in an effective manner thus increasing their performance and life.

11 Jan 2012

Active Electronic Components Market to Reach $230 Billion by 2017

Online research company, Market Research.com has announced that it has released a new report titled “Active Electronic Components: Technologies and Global Markets—Focus on North America”.

10 Jan 2012

Corning to Display Glass Innovation at International Consumer Electronics Show

Corning has declared its plans to participate in the International Consumer Electronics Show (CES) to be held in Las Vegas. The company will demonstrate the role of highly engineered specialty glass in meeting current trends, including robust large-format design aesthetics, touch technology, enhanced functionality from smaller form factors and connected devices in latest application spaces.

From Corning Incorporated 9 Jan 2012

Semiconductor Packaging Solutions Provider Breaks Ground for New Factory

STATS ChipPAC, a provider of semiconductor advanced packaging and test solutions, has conducted the groundbreaking ceremony for its new plant to be built close to its existing facility in Yishun, Singapore, to expand its production capabilities for sophisticated wafer level technologies such as through silicon via (TSV), integrated passive devices (IPD), wafer level chip scale packaging (WLCSP) and embedded wafer level ball grid array (eWLB).

6 Jan 2012

Introduction of UBC550L Series by ATC for Optical High-Speed Data Communications

ATC is a pioneer in producing millimeter-wave, microwave, and RF passive components. An ultra-broadband capacitor (UBC) has been developed for optical high-speed data communications signal integrity markets by ATC.

5 Jan 2012

Comprehensive Report Discusses Advanced IC Packaging Materials, Technologies and Markets

Research and Markets has declared that it now offers a new market research report titled, ‘Advanced IC Packaging Technologies, Materials, and Markets, 2011 Edition.’

27 Dec 2011

Editorial Highlights

The Current State of the Global Semiconductor Market

The global semiconductor market has entered an exciting period. Demand for chip technology is both driving the industry as well as hindering it, with current chip shortages predicted to last for some time. Current trends will likely shape the future of the industry, which is set to continue to show

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.

What Role Will The IoT Play In The Electric Vehicle Industry?

In recent years, the IoT is rapidly being introduced into almost all sectors, but it has particular importance in the EV industry.

Electronics News

Dow Corning Introduces Silicone-Based Materials for New Lighting Technology

Ioxus Unveils 3,000-F Ultracapacitor Line

IEE Extends its 3D Display Technologies to Retail Applications

Scientists from University of Twente Develop Rare-Earth-Ion-Doped Optical Amplifiers

New Material Could Increase the Performance of Electronics

Active Electronic Components Market to Reach $230 Billion by 2017

Corning to Display Glass Innovation at International Consumer Electronics Show

Semiconductor Packaging Solutions Provider Breaks Ground for New Factory

Introduction of UBC550L Series by ATC for Optical High-Speed Data Communications

Comprehensive Report Discusses Advanced IC Packaging Materials, Technologies and Markets

A New Approach to Flash Point Testing

How to Use AFM to Study 2D Materials and Superlattices

How are Fine Ceramics Supporting the Next Generation of Renewable Energy?

Advanced Masterbatch and Compounding for Polymers and Plastics

AirBreather Platform for Continuous Gas Analysis

SU7000 & SU8700 Schottky Field Emission SEMs: Ultra High-Resolution & Analytical Imaging

Sponsored Content

The Ultimate Guide to PPE for Rescue and Recovery Missions

Moisture, Volatiles and Ash Determination in Coal & Coke

Powering the Future: The Solid-State Battery Revolution

What is the Gold Foil Covering Spacecraft and Satellites?

Editorial Highlights

The Current State of the Global Semiconductor Market

How are Graphene Batteries Made?

What Role Will The IoT Play In The Electric Vehicle Industry?

Electronics News

A New Approach to Flash Point Testing

How to Use AFM to Study 2D Materials and Superlattices

How are Fine Ceramics Supporting the Next Generation of Renewable Energy?

1Smart Coatings: Thermally Responsive Polymer Brushes for Advanced Applications

23D-Printed Organic Tissue Models Mimic Living Organs

3Upcycling LDPE: Transforming Plastic Waste into High-Value Graphite

4Pioneering Large-Scale Aluminum 3D Printing

5Perovskite and Copper System Creates C2 Chemicals from CO2

6DS Smith Partner With TPV Automotive to Create a Sustainable Fiber-Based Packaging for the Protection of Car Wheel Carriers

Sponsored Content

Editorial Highlights