SEMATECH today announced that Cabot Microelectronics Corporation, the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing CMP pad supplier to the semiconductor industry, has joined its Front End Processes (FEP) program and will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications.
Mitsubishi Electric Corporation announced today it has developed a prototype multi-wire electrical discharge processing technology to cut very hard 4 inch square polycrystalline silicon carbide (SiC) ingots into 40 pieces at once. The technology is expected to improve both the productivity of SiC slicing and the effective use of SiC material. Mitsubishi Electric aims to market its multi-wire electrical discharge slicer by fiscal 2015.
eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced that An ASIC Low-Power Primer is now available from Springer, a leading publisher of science and technology reference books. Written by eSilicon engineers Dr. J. Bhasker, architect, and Dr. Rakesh Chadha, director of design technology, the book provides an invaluable primer on the techniques utilized in the design of low-power digital semiconductor devices.
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has estimated that its engineered substrates used in manufacturing semiconductors for mobile communications are incorporated in at least 50 percent of smart phones and internet-connected tablet computers being produced today.
Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The Dow Chemical Company, today launched the first pads from its new IKONIC™ 2000 and IKONIC™ 3000 polishing pad series.
Researchers at Rochester Institute of Technology, international semiconductor consortium SEMATECH and Texas State University have demonstrated that use of new methods and materials for building integrated circuits can reduce power—extending battery life to 10 times longer for mobile applications compared to conventional transistors.
C. Grant Willson, professor of chemistry and chemical engineering at The University of Texas at Austin, has won the Japan Prize, an international award similar to the Nobel Prize, for his development of a process that is now used to manufacture nearly all of the microprocessors and memory chips in the world.
3M announced today at DesignCon 2013 the full launch of its Embedded Capacitance Material (ECM) C2006. The ultra-thin laminate material is now available for high-volume manufacturing. With a capacitance density of approximately 20 nF per square inch, the material offers one of the highest capacitance densities currently available on the market in a halogen-free* product.
Voltaix, Inc. a leading manufacturer of specialty materials for the semiconductor and photovoltaic industries, and Linde Electronics, the global electronics business of The Linde Group, announced the signing of an agreement to expand disilane (Si2H6) capacity with the construction of a 40 metric ton Ultra High Purity (UHP) disilane plant.
Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, will demonstrate precision dispensing solutions for LED and semiconductor packaging at LED Korea 2013, booth #4228, Hall B. Applications include phosphor coating for tight CIE LEDs, high-throughput silicone phosphor encapsulation, pure silicone casting, flux, and underfill for flip chip, package-on-package (PoP), chip scale packages (CSP), and ball grid arrays (BGA).
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